Press Release Source: InterDigital, Inc.
InterDigital Signs Global Wireless to Worldwide 2G and 3G Patent License Agreement
Companies Also Enter Into Product Evaluation Agreement
Friday February 27, 2009, 10:53 am EST
Yahoo! Buzz Print Related:InterDigital, Inc.
KING OF PRUSSIA, Pa.--(BUSINESS WIRE)--InterDigital, Inc. (NASDAQ: IDCC - News) today announced that its patent licensing subsidiaries have entered into a non-exclusive, worldwide, royalty-bearing, patent license agreement with Global Wireless Technologies LLC (“Global Wireless”) covering the sale of terminal units and infrastructure compliant with 2G, 2.5G, 3G, and IEEE 802-based standards for the duration of the life of the licensed patents.
In addition, InterDigital Communications, LLC and Global Wireless entered into an Evaluation Agreement covering Global Wireless’ consideration and review of InterDigital's 2G and 3G SlimChip™ wireless modem technologies, related software and reference designs for potential incorporation into Global Wireless' products.
Global Wireless is a designer and developer of wireless solutions for the cellular access point and asset tracking markets. The company, based in New Jersey, provides complete integrated products for pico/Femto access points with IP backhaul to macro cellular networks using WCDMA/GSM, cdma/1xEVDO-A, and LTE technologies.
“This new agreement with a developer of innovative infrastructure solutions continues to expand InterDigital’s licensing coverage and furthers our participation in growing and pioneering segments of the wireless market,” commented Lawrence Shay, President of InterDigital’s patent subsidiaries.
About InterDigital
InterDigital® designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide. Additionally, the company offers a family of SlimChip high performance mobile broadband modem solutions, consisting of Baseband ICs, Embedded Modules, Modem IP and Reference Platforms. InterDigital's differentiated technology and product solutions deliver time-to-market, performance and cost benefits.
InterDigital is a registered trademark and SlimChip is a trademark of InterDigital, Inc.
For more information, visit: www.interdigital.com
Contact:
InterDigital, Inc.
Media Contact:
Jack Indekeu, +1 (610) 878-7800
Email: jack.indekeu@interdigital.com
or
Investor Contact:
Janet Point, +1 (610) 878-7800
Email: janet.point@interdigital.com
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