Tokyo Electron and Novellus Systems Announce Breakthrough
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(this probably helped fueling the "buyout frenzy"; eliminating the PVD Cu seed process is bad news for AMAT because it would eliminate one of AMAT's bread and butter applications; it could also help to open the door for NVLS to "penetrate" Toshiba)
It's old news but it fell through my "cracks"
Tokyo Electron and Novellus Systems Announce Breakthrough Results and
Collaboration on Copper Process Technology for 2Xnm and Beyond
PR Newswire
TOKYO and SAN JOSE, Calif., Dec. 1
TOKYO and SAN JOSE, Calif., Dec. 1 /PRNewswire-FirstCall/ -- Tokyo
Electron Ltd. (TEL) and Novellus Systems, Inc. (Nasdaq: NVLS) are pleased
to announce the availability of an integrated copper interconnect solution
for the 2Xnm generation and beyond. This integrated metallization scheme
is the result of a joint program established between the two companies for
the continuous advancement of copper interconnect technology.
(Photo: newscom.com
The co-developed process employs an ionized PVD TaN or Ti barrier capped
with an ultra-thin CVD Ruthenium (Ru) liner. This barrier and Ru liner is
then coupled with a proprietary copper wet seed process (eliminating the
PVD Cu seed process) and a copper electrochemical deposition process,
which yields fully-filled fine features at the 2Xnm node without the
issues associated with PVD liners and seeds.
Breakthrough results with this new metallization scheme are enabled by two
key process steps. The first key process in the scheme is a Ruthenium
liner layer deposited by a CVD process using the TEL Trias Tandem(TM)
system. The CVD Ru process offers exceptional feature conformality and
resistivity in aggressive damascene features at thicknesses of less than
or equal to 2nm (20 Angstroms). The proprietary CVD Ru process and
hardware provides excellent productivity and very efficient use of the Ru
precursor. In mass production, the consumable cost for the CVD Ru process
(including pre-clean and barrier processes) will be the most attractive
among all available options. This level of consumable cost is not
achievable with PVD Ru or ALD Ru.
The second key process step in the new metallization scheme is a wet
copper seed process called DirectSeed(TM) which is deposited in the
Novellus SABRE(R) Extreme(TM) electrochemical deposition tool. DirectSeed
from Novellus is a proprietary technology for depositing a smooth,
conformal Cu seed layer with thicknesses less than or equal to 3nm (30
Angstroms) directly on the CVD Ru substrate. The DirectSeed process
eliminates the need for a PVD Cu seed layer and eliminates the processing
challenges with PVD including step coverage, overhang and feature
shadowing. The industry-leading SABRE Extreme Electrofill(TM) process is
also used to deliver perfectly-filled Cu features at the 2Xnm node.
According to Go Okubo, vice president and general manager for the Single
Wafer Deposition Business Unit, Tokyo Electron Ltd, "The achievement of
our collaboration is a breakthrough in terms of realizing two long-awaited
technological advancements. One is the establishment of the innovative
integration technology, which assures copper fill at 2Xnm and beyond, and
opens new prospects for reducing line resistance. The other is the
substantial reduction of the process steps without sacrificing the benefit
of low CoC, which will contribute to maximizing our customers' profit.
Achieving this technological breakthrough came by combining the expertise
from TEL and Novellus. We will pursue our relationship to further improve
copper interconnect technology."
According to Tim Archer, executive vice president for Electrofill and
PECVD business units at Novellus Systems, "TEL and Novellus have joined
development forces to offer an exciting, attractive alternative to the
traditional PVD / Electrofill approach for 2Xnm and beyond. The
combination of the TEL CVD Ru liner and the Novellus Sabre DirectSeed(TM)
copper wet seed and Sabre Extreme Electrofill offer an extension of copper
fill to the finest features while improving the cost per wafer as well.
The partnership of TEL and Novellus also offers our customers tremendous
leverage by reducing or eliminating the development and integration time
and cost that follows the selection of individual processes."
About SABRE Extreme:
Building on the success of the SABRE NExT system, the SABRE Extreme is
targeted for the 3X and 2X technology nodes. SABRE Extreme features an
improved plating cell incorporating an advanced fluid management system
and current distribution technology, improving yield, on-wafer performance
and reducing cost-of-consumables. SABRE Extreme runs the most advanced
Electrofill(TM) chemistry, key to providing superior copper filling
capability on extremely narrow high-aspect-ratio features.
About Novellus:
Novellus Systems, Inc. (Nasdaq: NVLS) is a leading provider of advanced
process equipment for the global semiconductor industry. The company's
products deliver value to customers by providing innovative technology
backed by trusted productivity. An S&P 500 company, Novellus is
headquartered in San Jose, Calif. with subsidiary offices across the
globe. For more information, please visit novellus.com.
About Trias Tandem:
Trias Tandem is a product of Trias series featuring worldwide field-proven
productivity and reliability. It is a high vacuum apparatus capable of
accommodating PVD and CVD modules for copper interconnect process. Trias
Tandem with iPVD module and CVD Ru module developed by TEL is capable for
3X and 2X technology nodes.
About Tokyo Electron Ltd:
Tokyo Electron Ltd, established in 1963, is a leading supplier of
innovative semiconductor and FPD production equipment worldwide. In Japan,
TEL also distributes computer network related products and electronic
components of global leading suppliers. To support this diverse product
base, TEL is strategically located around the world. TEL is a publicly
held company listed on the Tokyo Stock Exchange. For more information,
please visit tel.com.
SABRE is a registered trademark, and SABRE Electrofill, SABRE Extreme and
SABRE DirectSeed are trademarks of Novellus Systems, Inc.
Trias and Trias Tandem are registered trademarks of Tokyo Electron Ltd.
SOURCE Novellus Systems, Inc.
Website: novellus.com
Website: tel.com
Contact: Michelle Pesez of Tokyo Electron US Holdings, +1-512-424-1757,
michelle.pesez@us.tel.com; or Pushpita Prasad of Novellus Systems, Inc.,
+1-408-943-9700, pushpita.prasad@novellus.com
Last Updated: December 1, 2008 08:30 EST |
