For a long time I knew Micron ahead of the game but Lam's Newberry is correct in his comments about copper transition.
The TEL NVLS combo could make it vey hard forthe evil empire - TEL's CVD coupled with NVLS Cu plating seems to be a brilliant piece of process integration while reducing manufacturing steps/cost.
In a similar way NVLS and ATMI.
The NVLS press release does not refer to flash directly but it does indirectly ... Device manufacturers need solutions to these problems to enable the next generation of consumer-driven applications such as solid state drives and smart phones...
and who implied Apple does not need NVLS al
And BTW Toshiba has pulled in volume production @ 32 nm by a couple of months (people got so used to Moore's law but to me it remains min blowing)
Another blurb stated that Intel is doing so well with 32nm that the will skip 45nm for certain products - it's hard to follow all those different name:
Intel's 45nm Havendale/Auburndale might not be produced since the 32nm is doing so well
legitreviews.com
Novellus' Suppression-Enhanced Fill(TM) Technology Provides Defect-Free 32nm Copper Interconnects
April 9, 2009
Unique Hardware and Process Chemistry Extend Cu Manufacturing Capability
SAN JOSE, Calif., April 9 /PRNewswire-FirstCall/ -- Since the advent of copper damascene processing, achieving void-free fill of high aspect ratio interconnect features has been a key challenge for device manufacturers. Shrinking dimensions at each successive technology node have increased the complexity of the copper seed and electroplating processes, and stringent yield and reliability requirements have intensified the focus on reducing defects. Copper interconnect defects can be caused by a multitude of factors, including post-patterning etch residue, discontinuous barrier or seed layers, and inadequate electroplating nucleation and deposition. Overcoming these interconnect scaling challenges is paramount to increasing memory bit density, shrinking chip form factor and enhancing circuit functionality. Device manufacturers need solutions to these problems to enable the next generation of consumer-driven applications such as solid state drives and smart phones.
(Photo: newscom.com
To address the manufacturing challenges associated with advanced copper interconnects, Novellus (Nasdaq: NVLS) researchers have developed an innovative copper electrochemical process called Suppression-Enhanced Fill(TM) (SEF) that eliminates defects when scaling to the 32nm technology node. The SEF process utilizes unique capabilities of the company's SABRE(R) Extreme platform to simultaneously enhance current suppression on the wafer field and within the upper sidewalls of contacts and trenches while permitting copper deposition to initiate rapidly from the bottom of these features. In addition, SEF increases fill nucleation density and decreases the possibility of seed dissolution, resulting in copper electrofill that is easier to integrate with today's barrier and seed technologies. Figure 1 shows 32nm features filled using the SEF process, resulting in a more robust, void-free fill.
"With SEF, our goal is to provide a new electroplating process that allows our customers to transition to the 32nm technology node with minimal process changes and capital expenditure," said Dr. Andrew McKerrow, director of technology for the company's Electrofill business unit. "SEF has been adopted by our leading edge memory and logic customers for their 32nm technology node and is already a key part of the effort to extend Cu interconnects to 2Xnm."
For more information on the new SEF technology for 32nm fill requirements, visit novellustechnews.com
About Novellus' Electrochemical Deposition Technology:
For high-volume manufacturing applications at 45nm and beyond, Novellus' advanced copper electrochemical deposition hardware, processes, and chemistries combine industry-leading throughput while providing bottom-up, void-free filling of advanced device structures. Nine out of 10 copper wafers in the world are manufactured on Novellus SABRE Electrofill(R) systems.
About Novellus:
Novellus Systems, Inc. (NASDAQ: NVLS) is a leading provider of advanced process equipment for the global semiconductor industry. The company's products deliver value to customers by providing innovative technology backed by trusted productivity. An S&P 500 company, Novellus is headquartered in San Jose, Calif. with subsidiary offices across the globe. For more information, please visit www.novellus.com
SOURCE Novellus Systems, Inc.
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Toshiba develops cost-effective 32nm CMOS platform technology by advanced single exposure lithography
December 18th, 2008
Toshiba Corporation today announced a cost-effective 32nm CMOS platform technology that offers higher density and improved performance while halving the cost per function from 45nm technology.
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The platform was achieved by application of advanced single exposure lithography and gate-first metal gate/high-K process technology. This technology enables a 0.124µm2 SRAM cell and a gate density of 3,650 gate/mm2. This SRAM cell is the smallest yet achieved in the 32nm generation. The platform technology is based on a 32nm process technology developed jointly with NEC Electronics Corporation.
Advanced semiconductor process migration faces challenges to achieve both cost competitiveness and enhanced performance for stricter design rules. This requires innovative technological optimization in lithography and patterning integration, materials, and device design.
Realizing the strict design rule in the 32nm generation was originally seen as requiring dual exposure technology in the lithography process, which would result in higher process costs due to increased process steps, and in degraded manufacturing yields owing to increased process dusts. Toshiba realized an architecture based on single exposure lithography by applying ArF immersion lithography with a NA 1.3 and over, and by optimizing the lithography illumination conditions.
The development work also demonstrated that application of a metal gate/high-K not only boosts transistor performance but also reduces threshold voltage mismatch, which affects stable operation of SRAM and logic circuits. In addition, a bent-shaped type cell was selected for layout optimization, which also contributed to reduce threshold voltage mismatch.
By adopting this approach, Toshiba realized a 32nm CMOS platform design that reduces cost per function by 50% from 45nm technology, an achievement that would have been impossible with conventional poly/SiON and double patterning.
Toshiba will further enhance development of the new platform.
The achievement was introduced today at the International Electron Devices meeting (IEDM) in San Francisco, CA.
Provided by Toshiba
Novellus, ATMI and Enthone Introduce Enhanced Electrochemical Deposition Process for Copper
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March 17, 2009 8:30 AM EDT
Three-way Collaboration Advances Copper Interconnect Technology for 32 Nanometers and Beyond
DANBURY, Conn., March 17 /PRNewswire-FirstCall/ -- Novellus Systems (Nasdaq: NVLS), ATMI, Inc. (Nasdaq: ATMI), and Enthone Inc. today introduced ViaForm(R) Extreme Pura(TM), a new copper deposition process and chemistry for manufacturing advanced copper interconnects at 32 nanometers (nm) and beyond. This new process technology provides a high degree of process control, enables a more robust interconnect fill capability and ensures greater device reliability.
(Photo: newscom.com
(Logo: newscom.com
(Logo: newscom.com
(Logo: newscom.com
The process was developed through a three-way partnership among Novellus, a provider of advanced process equipment for the global semiconductor industry, ATMI, and Enthone, a manufacturer and developer of high performance semiconductor products. Through an agreement with Enthone, ATMI markets and distributes ViaForm Extreme Pura worldwide for exclusive use on Novellus' market leading SABRE(R) Electrochemical Deposition product line. ViaForm Extreme Pura is available for immediate use.
In 2003, ATMI and Enthone formed a partnership to develop and distribute state-of-the-art electrochemistries to meet the developing need for manufacturing advanced copper interconnects. Since then, the ViaForm family of plating chemistries and the Novellus SABRE system have consistently met the stringent performance, uniformity, and device yield parameters required by the world's leading manufacturers of copper chips.
"Novellus is focused on providing innovative solutions to the industry's most challenging copper extendibility problems," said Dr. Andrew McKerrow, director of technology for Electrofill at Novellus Systems. "The Pura chemistry has demonstrated improved fill and defect performance at beta customer sites and allows customers to extend their existing technology to the next generation while minimizing cost."
"It's critical for us to meet the unique manufacturing requirements of our semiconductor customers," said Mike Besnard, ATMI Materials director of marketing. "We provide the ability to create copper films that are of high purity, have low defectivity, and consistently deliver the performance and yield that our customers require."
"At 32 nm, copper plating is a critical technology for both memory and logic devices," said Richard Hurtubise, global product line manager - semiconductor products, Enthone. "ViaForm Extreme Pura has a clear advantage in that it meets the demands of shrinking device geometries while giving chip manufacturers the flexibility to apply this chemistry to their existing processes and installed base of Novellus SABRE systems."
About Novellus
Novellus Systems, Inc. (Nasdaq: NVLS) is a leading provider of advanced process equipment for the global semiconductor industry. The company's products deliver value to customers by providing innovative technology backed by trusted productivity. An S&P 500 company, Novellus is headquartered in San Jose, Calif., with subsidiary offices around the globe. For more information, please visit www.novellus.com.
About ATMI
ATMI provides specialty materials and high-purity materials handling and delivery solutions to the worldwide semiconductor industry. For more information, please visit atmi.com.
About Enthone
Enthone Inc. is a business of Cookson Electronics. The company is a leading supplier of high performance specialty chemicals and coatings used in the electronics and surface finishing industries. Enthone manufactures, markets and distributes its functional, decorative and electronic processes that are used in printed wiring board, semiconductor, photovoltaic, automotive, aerospace, jewelry and plumbing applications.
About Cookson Electronics
Cookson Electronics is a leading materials science company that provides high performance materials, chemistry, and technology solutions to the electronics and surface finishing industries worldwide. The company delivers superior value by providing truly differentiated products, services and support through its Alpha, Enthone and Cookson Electronics - Semiconductor Products businesses. For more information, please visit www.cooksonelectronics.com.
"Safe Harbor" Statement
Statements contained herein that relate to ATMI's future performance, including, without limitation, statements with respect to ATMI's anticipated results of operations or level of business for 2008 or any other future period, are forward-looking statements within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Such statements are based on current expectations only and are subject to certain risks, uncertainties, and assumptions, including, but not limited to, changes in semiconductor industry growth (including, without limitation, wafer starts) or ATMI's markets; competition, problems, or delays developing, commercializing and delivering new products; problems or delays in integrating acquired operations and businesses; uncertainty in the credit and financial markets; and other factors described in ATMI's Form 10-K for the year ended December 31, 2007, and other subsequent filings with the Securities and Exchange Commission. Such risks and uncertainties may cause actual results to differ materially from those expressed in our forward-looking statements. ATMI undertakes no obligation to update any forward-looking statements.
SABRE and Electrofill are registered trademarks, and SABRE Extreme is a trademark of Novellus Systems, Inc. ATMI and the ATMI logo are trademarks or registered trademarks of Advanced Technology Materials, Inc., in the United States, other countries or both. ViaForm is a registered trademark and Pura is a trademark of Enthone Inc.
www.novellus.com
www.atmi.com
www.cooksonelectronics.com
SOURCE Novellus Systems, Inc. |
