<<off topic>> Fujitsu to use "mini-environments" in its fabs.
A service of Semiconductor Business News, CMP Media Inc.
Story posted at 4:30 p.m. EST/1:30 p.m. PST, 11/5/97
Fujitsu plans fab mini-environment
based on design by Jenoptik Infab
TOKYO -- Fujitsu Ltd. here on Friday plans to announce it will become the
first Japanese chip maker to use SMIF-based pods to process 200-mm
wafers mini-environments. The move represents a significant change in how
Fujitsu sets up its wafer fabs.
Fujitsu--like other major Japanese chip makers--has advocated IC
fabrication using open wafer cassettes, which require large cleanrooms with
stringent environments. With wafer sizes increasing and feature sizes
shrinking, semiconductor manufacturers in other regions have switched the
use of mini-environments, which protect silicon surfaces in closed pods
during chip processing.
The closed pods can dramatically reduced the high cost of cleanrooms in
new fabs, according to mini-environment proponents. The pods maintain
mini-environments at Class 1 and 10 levels, while cleanrooms can be kept at
less stringent Class 100 levels.
During a Tokyo press conference on Friday, Fujitsu will announce an
agreement with Jenoptik Infab of Jena, Germany, which will create the first
mini-environment for a Japanese chip company, according company
managers.
During July's Semicon West equipment conference in San Francisco,
Japanese semiconductor companies began discussions with wafer carrier
suppliers, indicating that many were beginning to reconsider the use of open
cassettes and switch to closed pods, using based on standard mechanical
interfaces (known as SMIFs). Some sources said the Japanese chip makers
had delayed the move to pods because Japan's fab equipment makers had
been slow in embracing mini-environments (see July 16 news story).
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