ACHRONIX TO BUILD THE WORLD’S
MOST ADVANCED FIELD
PROGRAMMABLE GATE ARRAYS
(FPGAs) ON INTEL 22NM PROCESS
TECHNOLOGY
San Jose, Calif. — Achronix Semiconductor Corp. today announced strategic access
to Intel Corporation’s 22 nanometer (nm) process technology, and plans to develop
the most advanced Field Programmable Gate Arrays (FPGAs).
The Achronix Speedster22i FPGA family will shatter existing limitations of FPGAs,
allowing cost effective production of high performance devices over 2.5M LUTs in
size, equivalent to an ASIC of over 20 million gates.
Taking advantage of the performance and power savings of Intel’s 22nm process
technology, Speedster22i will also extend the boundaries of FPGA speed and power
efficiency, enabling as much as 300% higher performance, 50% lower power, and
40% lower cost than any other FPGA in any other process technology.
Achronix Speedster22i will be suitable for a wide range of applications in the
telecommunication, networking, industrial and consumer markets and will enable
emerging applications such as 100G, 400G Ethernet networking and LTE mobile
communications. Additionally, Speedster22i will be the first commercial FPGA family
that can be manufactured in the United States of America, making it the ideal
platform for military and aerospace applications requiring “on shore” silicon.
“Intel’s manufacturing strengths and lead in process technology offers leadership cost,
performance and power efficiency benefits, giving Intel and our manufacturing
customers such as Achronix an opportunity to design products with superior
capabilities,” said Sunit Rikhi, vice president, Technology and Manufacturing Group,
Intel.
“Intel has the best process technology in the world and we are privileged to have
formed this strategic relationship, which enables simultaneous improvements in
speed, power, density and cost,” said John Lofton Holt, CEO of Achronix. “The
combination of the advanced 22nm process from Intel and the advanced FPGA
technology from Achronix enables Speedster22i to eclipse other FPGA solutions
expected to hit the market in the next few years.” |
