Maxim begins shipping analog chips built on 300mm wafers
(November 5, 2010 - GLOBE NEWSWIRE) -- Maxim Integrated Products (Nasdaq:MXIM) qualified and shipped production analog product built on 300mm wafers. This gives Maxim a significant technology edge in the analog/mixed-signal market.
Maxim president and CEO Tunc Doluca, group president Vijay Ullal, and SVP of operations Vivek Jain holding the first 300mm wafer.
Maxim president and CEO Tunc Doluca, group president Vijay Ullal, and SVP of operations Vivek Jain holding the first 300mm wafer.
Maxim is now producing 300mm wafers using its 180nm BCD analog process technology (S18) in Powerchip Technology Corporation's wafer fab through a foundry agreement. This achievement gives Maxim a strategic advantage in the analog market, providing a capital-efficient manufacturing model that enables quick response to changing market conditions. It extends Maxim's hybrid approach to wafer fab capacity, utilizing both in-house and outsourced wafer fabrication. This concept was introduced by Maxim in 2007 when MXIM partnered with Seiko Epson.
"Our manufacturing and R&D teams worked closely with Powerchip's team to qualify Maxim's S18 BCD technology for 300mm wafers in record time," commented Tunc Doluca, Maxim's President and CEO.
Maxim Integrated Products is a publicly traded company that designs, manufactures, and sells high-performance semiconductor products. For more information, go to www.maxim-ic.com.
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