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Wednesday November 12, 8:02 am Eastern Time
Company Press Release
Dense-Pac Microsystems Begins Delivery of Flash
Memory DIMM for Newly Introducted HP LaserJet 4000
Printer
GARDEN GROVE, Calif.--(BUSINESS WIRE)--Nov. 12, 1997--Dense-Pac Microsystems Inc.
(NASDAQ:DPAC - news) Wednesday announced that its newly acquired subsidiary, TypeHaus
Inc. is now shipping its D1400 DIMM for use in Hewlett-Packard company's (NYSE:HWP -
news) LaserJet 4000 printer introduced Monday, Nov. 10 by HP Workgroup LaserJet division.
The 1400 DIMM is immediately available and orders can be placed through Dense-Pac's Web
page (www.dense-pac.com) .
Dense-Pac's memory device is designed for use as a non-volatile storage system for fonts, forms,
macros and printer personalities for advanced printing applications.
Uri Levy, chairman and chief executive officer of Dense-Pac said: ''The acquisition of TypeHaus
has provided Dense-Pac the opportunity to expand into the laser printer marketplace and leverage
other products offered by Dense-Pac.
''Dense-Pac and TypeHaus are both approved third party developers of HP. HP provided
Dense-Pac with a LaserJet 4000 and its specifications prior to its market introduction in order for
us to develop this product.''
The new DIMM product was designed and manufactured at Dense Pac's corporate location in
California.
The new Flash Memory DIMM for HP represents Dense-Pac's first penetration into the laser
printer market. Levy, who is the author of the book ''Non-Impact Electronic Printing,'' published by
Interquest in 1993, has contributed for several years to the solutions to laser printing applications.
Dense-Pac recently acquired TypeHaus to expand sales into this new market.
There are two versions of the new DIMM -- one that can be programmed in the printer, using HP's
new proprietary Flash System architecture, and the other that is programmed outside the printer for
custom applications.
Bill Bailey, president of TypeHaus, commented: ''This new product will keep Dense-Pac/TypeHaus
in the forefront as the foremost supplier to solutions providers for HP customers. This new product
line demonstrates TypeHaus' commitment to delivering the latest technology to our OEM customers
with the ISO9001 certified manufacturing quality of Dense-Pac, our parent company, at a
competitive price.''
TypeHaus is an OEM developer of technology relating to digital imaging. With over 20 years in the
industry, Bailey has lead the development of many industry firsts. Bailey created WinFonts and
FontMaker, the first Windows based scalable type programs and he has developed products that
have been licensed to most of the major laser printer manufacturers.
The D1400 DIMM is a 100 pin Dual-Inline-Memory Module conforming to the new JEDEC
Standard JC11.14-96-90 that was pioneered by HP. The Flash File System in the new DIMMs
allows resellers, third party providers, and corporate end users to store electronic forms, logos, and
fonts in the printer, eliminating the use of expensive pre-printed forms.
Dense-Pac Microsystems designs and manufactures proprietary and patented three-dimensional
high density memory products that allow the company's commercial, industrial and military
customers to pack huge amounts of memory into small spaces. Its commercial products include
applications such as cellular phones and other hand-held personal communications, laptops and
notebooks, super computers and servers, digital cameras, portable electronic organizers, storage
devices, electronic keyboards and digital sound systems, medical instrumentation, airborne and
space avionics and such diverse areas as space satellites and space missiles, and high performance
auto engines. The company's Web site is at www.dense-pac.com .
Statements regarding the company's expectations about growth and marketing strategies, new and
existing products, future financial performance and other forward looking statements are subject to
various risks and uncertainties, including, without limitation, demand and acceptance of new and
existing products, technological advances and product obsolescence, availability of semiconductor
devices at reasonable prices, competitive factors and the availability of capital to finance growth.
These and other risks are discussed in greater detail in the company's filings with the Securities and
Exchange Commission.
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