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Technology Stocks : Cymer (CYMI)
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To: Zeev Hed who wrote (9814)11/16/1997 12:52:00 AM
From: Maxwell  Read Replies (1) of 25960
 
Zeev:

I don't think you really understand what I was talking about. For you to electroplate Copper you need a "seed layer" which is also copper about 500 angstrom in thickness. The way you deposit seed layer is through CVD method. Deposition using CVD means you deposit copper everywhere, inside the trenches as well as on top of the oxide. Electroplating is then done (also an electrodeless method) on top of the seed layer in a sink. You then need to polish off the copper off. The copper on top of the oxide gets polish away. The copper in the trenches remain and form metal lines for interconnect.

Your method also works but it takes more steps than the one I described above.

Maxwell
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