IBM is building an advanced chip manufacturing testbed in New York. It will use 300mm wafers and x-ray lithography. Don't forget, it will take some time for this tech to become commercial. A more detailed story is available in the WSJ....................
biz.yahoo.com
Monday November 17, 4:20 am Eastern Time
IBM to build $700 mln chip facility - WSJ
NEW YORK, Nov 17 (Reuters) - International Business Machines Corp (NYSE:IBM - news) is
expected to announced Monday that it will build a $700 million advanced computer chip
development facility in upstate New York, the Wall Street Journal said on Monday.
IBM is also set to announce it has ended a two-year attempt to sell its old headquarters building in
Armonk, N.Y., and instead will spend $10 million to renovate it to house its IBM Credit Corp unit,
the paper said in its electronic edition.
The two moves are expected to create about 500 new jobs, the paper said.
IBM's testbed facility, to be located in East Fishkill, N.Y., will have 400 jobs when fully operational
in late 1999.
For its investments and job creation, IBM is getting grants and a sales-tax abatement from New
York state totalling about $21 million, in addition to unspecified local incentives, the paper said. |
