SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Asyst Technologies (ASYT) Good Value/Where is the Bottom?

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: MonsieurGonzo who wrote (559)11/18/1997 12:28:00 PM
From: Paul Dieterich  Read Replies (2) of 2313
 
Although Asyst did not get this contract, it gives evidence of a strong trend for SMIF:

Fujitsu moves to minienvironments in preparation of 300-mm processing

A service of Semiconductor Business News, CMP Media Inc.
Story posted at 9:30 a.m. EST/6:30 a.m. PST, 11/18/97

TOKYO--In preparation for next-generation 300-mm wafer processing, Fujitsu Ltd. said it plans to move from open wafer transport cassettes to closed minienvironment pods in a new 200-mm production line planned in Mie, Japan.

As reported earlier this month by Semiconductor Business Ness (Nov. 5), the new fab is expected to be the first in Japan to use minienvironment carrierd based on Standard Mechanical Interfaces, known as SMIF. While other chip makers around the world have moved to closed wafer pods, Japanese manufacturers have continued to use open cassettes and large cleanrooms, which are becoming more difficult to control as device feature sizes shrink below a quarter micron.

"Minienvironments are not now being used in Japan, but the concept makes sense to us. We are not even considering open cassettes when it comes to 300 mm production, so this project is intended to familiarize us with the technology of the future," said Toshihiko Osada, general manager of planning in Fujitsu's Manufacturing Engineering Division.

Fujitsu has named Jenoptik Infab of Jena, Germany, as the fab automation contractor for the new 200-mm fab line.

Osada said that because a wafers in SMIFs are protected by minienvironments from in the fab, it is possible to begin processing them while work is continuing on the facility around them. This allows the fab to be set up faster, he added.

"We are beginning equipment installation in January and we anticipate running first wafers in April, a timetable that would not be possible with open cassettes," the Fujitsu executive said.

Other Japanese chip makers are expected to follow Fujitsu in switching from open cassettes and large "ballroom" cleanrooms to protective SMIF pods and minienvironments. The hints of such a move were heard during the Semicon West equipment conference (see July 15 story), but Fujitsu is the first to announce the major shift in fab strategy.
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext