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Technology Stocks : General Lithography
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To: TheSpecialist who wrote (690)11/19/1997 4:24:00 AM
From: FJB  Read Replies (1) of 1305
 
News blurb.
NEC has developed high-precision aluminum circuit production technologies for manufacturing LSIs with 0.18 micron and eventually even 0.13 micron lines. These are technologies which promise for etching high aspect ratio aluminum lines in layered barrier metal structures. A resist layer for excimer lasers is used in small wiring layouts, and the thickness of the layer must be less than the selected aspect ratio. By diffracting the change in the amount of resist etching, NEC has found that the etching speed in barrier metal and cup metal of titanium nitride is an important factor in aiding reduction of the thickness of resist mask. The thinner the line being laid, the more critical the selected ratio in the resist. Trifluoromethane and other additives can be mixed with the chlorine etching gas to aid the selectivity and improve the durability of the etching.
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