Xilinx Discusses Stacked Silicon Interconnect Technologies and Demonstrates
Newest 28nm 7 Series FPGAs at DesignCon 2012
SAN JOSE, Calif., Jan. 26, 2012 /PRNewswire via COMTEX/ -- Xilinx, Inc. (XLNX)
today announced participation at DesignCon 2012 in Santa Clara, from January 30 -
February 2, at the Santa Clara Convention Center, Booth #732. Xilinx Corporate
Vice President, FPGA Development and Silicon Technology, Liam Madden, will
jumpstart Xilinx's activities by discussing the benefits and drawbacks of 3D IC
standards in the Why Do We Need 3D Design Standards? panel. Xilinx industry
experts will also present papers on Stacked Silicon interposer technology and the
design benefits of using the Zynq(TM)-7000 Extensible Processing Platform (EPP).
Throughout the week, Xilinx will demonstrate the latest Xilinx? FPGA platforms
featuring advanced Digital Signal Processing (DSP) performance, low power, FMC
migration, high-speed connectivity, and Xilinx's Agile Mixed Signal (AMS)
Analog-to-Digital Converter (ADC).
What: DesignCon 2012
Where: Santa Clara, CA, Santa Clara Convention Center, Booth #732
When: Conference & Exhibits - January 30 - February 2, 2012
Panels Tuesday, January 31 3:45 p.m. - 5:00 p.m., Ballroom E Why Do We Need 3D
Design Standards? In this panel, Madden will explore whether the design community
needs 3D-IC standards to accelerate the adoption of 3D design, and if so, how the
standards can be implemented, the priority of these required standards, the
challenges of applying these standards and how to get started. Panel participants
will also provide their insights on how the many different industry groups are
working together to prevent overlapping efforts or missing critical areas.
Papers Wednesday, February 1 9:20 a.m. - 10:00 a.m., Great America J Low
cost/ultra high density and high performance wirebond package design and SI/PI
analysis for FPGA with embedded dual core ARM CPU and dedicated DDR3 memory
channel During this presentation, Xilinx Senior Staff Signal Integrity Engineer,
Namhoon Kim, will explore how the Xilinx Zynq-7000 EPP redefines the
possibilities for embedded systems and how it gives system/software architects
and developers a flexible platform to launch their new solutions. A detailed
understanding and accurate modeling for estimating the worst-case noise both on
physical layout and system levels is essential. Kim will introduce a full
system-level simulation methodology to verify timing margin and voltage margin.
Wednesday, February 1 2:50 p.m. - 3:30 p.m., Ballroom C Full System Channel
Co-Optimization for 28GB/S Serdes FPGA Applications with Stacked Silicon
Interposer Technology Kim will also present a paper on Stacked Silicon interposer
technology, the technology requirements and manufacturing processes to support
28GB/S Serdes application, and the package/PCB design methodology for high speed
systems.
Exhibition Demos Tuesday-Wednesday, January 31 - February 1 Kintex(TM)-7
FPGA-based reference design demonstrations Using Kintex-7 325T FPGAs, Xilinx will
demonstrate Kintex-7 FPGA-based reference designs featuring AMS, high-speed
analog interface with DUC/DDC, and dynamic and static power reduction. The
demonstrations will enable the use of real world analog data without requiring
expensive test equipment, optimize system performance in both the analog and
digital domains, and reduce power consumption.
Workshops Wednesday, February 1 2:00 p.m. - 4:00 p.m., Ballroom H CPS for 3D-IC
and Power-Thermal-Mechanical-Electrical Applications In this interactive
workshop, Xilinx Distinguished Engineer, Simon Burke, and others will examine the
various modeling and simulation challenges in 3D-IC design. Methodologies for the
analysis of power delivery network, chip-to-chip communication, and thermal
integrity will be covered using real case studies in designs.
About DesignCon 2012 DesignCon is the largest meeting of board designers, and the
only event to address chip design engineers' chip/system/package challenges. For
more information, visit designcon.com.
About Xilinx Xilinx is the world's leading provider of programmable platforms.
For more information, visit: xilinx.com.
#1205e
Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other
designated brands included herein are trademarks of Xilinx in the United States
and other countries. All other trademarks are the property of their respective
owners.
Xilinx
Bruce Fienberg
408-879-4631
Bruce.Fienberg@xilinx.com |
