Xilinx Reaches Industry Milestone with Record-Fast 28nm Product Rollout: $1B in
Design Wins, Thousands of Device Shipments in First Year of Introduction
Company fuels highest bandwidth systems with Virtex-7 FPGAs, meets aggressive
cost/power requirements with Kintex-7 FPGAs, achieves unrivaled
performance/flexibility with Zynq-7000 EPP
SAN JOSE, Calif., Feb. 14, 2012 /PRNewswire via COMTEX/ -- Xilinx, Inc. (XLNX)
today announced it has reached an industry milestone with over $1B in design wins
for its newest line of 28nm field programmable gate array (FPGA) and extensible
processing platform (EPP) devices.
To date, the company has shipped thousands of Virtex?-7, Virtex-7 2000T 2.5D
stacked silicon interconnect (SSI), Kintex(TM)-7 and Zynq(TM)-7000 devices
worldwide to more than 90 discrete customers for nearly 350 design wins. With
Xilinx 28nm devices, engineering teams can easily migrate designs between product
families and build scalable systems that span the entire product portfolio for a
diverse set of applications, including: high-performance defense radar and video
processing systems, leading-edge 200G wired communication bridges and LTE
wireless communication equipment, ultra-high resolution medical imaging, advanced
tools for life science research, life-saving automotive driver assistance
systems, and high-precision factory automation equipment, to name a few.
"L-3 WESCAM is using the new 28nm product line from Xilinx to reduce electronics
size and power consumption as we implement our next generation of advanced video
processing algorithms for our surveillance and targeting products," said Steve
Tritchew, chief technology officer at L-3 WESCAM. "The Zynq Extensible Processing
Platform adds a high performance industry standard dual core ARM A9 processor
subsystem that will further increase our electronics integration, while reducing
complexity and power consumption. We expect Xilinx's next-generation software
tool to help accelerate our product development by significantly reducing compile
execution times, and providing open, industry standard support for IP libraries
that should significantly improve the effectiveness of our IP re-use."
A combination of Xilinx's 28nm architecture and broad portfolio of market-tuned
devices manufactured using TSMC's 28nm HPL (high-performance/low power) process
has enabled the company to execute the PLD industry's fastest rollout. Xilinx has
shipped four out of five product families in just 11 months - less than half the
time it took to roll out initial devices in just two product families in the
previous generation. The company is also shipping three new 7 series Targeted
Design Platforms for accelerating systems development and integration. These are
the first among nearly 40 to be delivered by Xilinx and/or ecosystem members
supporting embedded and high-speed connectivity applications, as well as markets
such as automotive, broadcast, consumer, industrial and communications.
"History has shown that the first PLD vendor to deliver products at a new process
node secures a significant advantage for the lifetime of those products," said
Jordan Selburn, principal analyst at market research firm IHS iSuppli, El
Segundo, Calif. "The 28nm node looks to be a particularly important step for
PLDs, allowing these devices to take over a meaningful amount of system functions
on a device that combines both hardware and software programmability, and
delivering above-market growth for the industry. Xilinx appears to be gaining
momentum with a broad portfolio of 28nm products that meet the needs of a growing
base of customers."
Xilinx has taped out more than 10 devices and expects to be sampling all members
of its 28nm portfolio by mid-2012. The Kintex-7 K325T device recently passed
rigorous qualification criteria and is on track for broad-based customer
shipments in production volumes in the June quarter. TSMC's fully qualified HPL
process has given Xilinx a tremendous time-to-market advantage and is providing
yields in line with the company's aggressive roadmap and better than previous
generations.
"TSMC is pleased to be collaborating with Xilinx on the successful rollout of its
28nm devices," said Sajiv Dalal, Vice President, TSMC North America. "We see
growing customer demands in TSMC's 28nm HPL process technology. TSMC's 28nm HPL
process is delivering ultra low-leakage, high-performance features needed by
advanced technology customers, ranging from high performance systems to mobile
consumer applications."
In addition to providing customers with access to 28nm technology in record time,
Xilinx is fueling the highest bandwidth systems with Virtex-7 FPGAs and meeting
aggressive cost and power requirements with Kintex-7 FPGAs for wide range of
applications in the fastest growing segment of the FPGA market. The remaining 7
series family, Artix(TM)-7, is designed to address high-volume, cost-sensitive
markets. With the Zynq-7000 EPP, Xilinx is meeting demand for unrivaled levels of
system performance, flexibility and integration in a new class of system-on-chip
that combines an industry-standard ARM? dual-core processing system with 28nm
programmable logic architecture. For some applications, a single Zynq-7000 EPP
device can replace a processor, DSP and FPGA.
To learn more about 7 series and Zynq-7000 EPP, see xilinx.com and
xilinx.com.
About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. For more
information, visit xilinx.com.
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Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other
designated brands included herein are trademarks of Xilinx in the United States
and other countries. ARM is a trademark of ARM in the EU and other countries. All
other trademarks are the property of their respective owners.
Editorial Contact:
Xilinx, Inc.
Lisa Washington
408-626-6272
lisa.washington@xilinx.com |
