Xilinx and Micron Demonstrate Industry's First Hardware Interoperability of FPGA
and RLDRAM 3 Memory Interface Standard
Xilinx 7 Series FPGA/Micron RLDRAM 3 Platform Enables Substantially Higher Data
Rates for 40G and 100G Networking Systems
SAN JOSE, Calif., and BOISE, Idaho, March 13, 2012 /PRNewswire via COMTEX/ --
Xilinx, Inc. (XLNX) and Micron Technology, Inc. (MU), today announced the first
public hardware demonstration of an FPGA interfacing with RLDRAM 3 memory, a new
and emerging memory standard for high-end networking applications such as packet
buffering and inspection, linked lists, and lookup tables. Operating with
Virtex?-7 and Kintex(TM)-7 FPGAs at data rates up to 1600 megabits per second
(Mb/s), Micron's high-performance RLDRAM 3 memory combines high density, high
bandwidth and fast SRAM-like random access to enable a 60 percent higher data
rate and memory bandwidth compared to that of the previous generation (Virtex-6
FPGAs/RLDRAM2 memory standard). RLDRAM 3 memory enables 40G and 100G networking
systems that require higher speed, higher density, lower power and lower latency.
Virtex-7 and Kintex-7 FPGAs are designed with the necessary IO standards and
architectural components for optimal interfacing with RLDRAM 3, providing a
significant boost to system performance for high-performance wireless and wired
networking systems. RLDRAM 3 memory uses innovative circuit design to minimize
the time between the beginning of an access cycle and the instant that the first
data is available. Ultra-low bus turnaround time enables higher sustainable
bandwidth with near-term balanced read-to-write ratios.
"The new RLDRAM 3 interface is ideal for Xilinx and Micron's mutual customers in
the high-end networking space who require higher speed, higher density, lower
power and lower latency," said Derek Curd, technical marketing manager at Xilinx.
"The RLDRAM 3 hardware demonstration shows how we're able to achieve a much more
efficient transfer of network data."
A video of the new Virtex-7 FPGA and Micron RLDRAM 3 memory interface solution
from Xilinx and Micron can be viewed at:
xilinx.com or micronblogs.com.
"Xilinx has been a longtime partner of Micron, going back to the early definition
efforts of RLDRAM 3 memory," said Robert Feurle, vice president of Micron's DRAM
marketing. "Together, we welcome the ability to demonstrate and deliver
performance advantages of RLDRAM 3 with the latest Virtex-7 and Kintex-7
families."
Availability/Ordering Information
Hardware demonstrations of the Xilinx RLDRAM 3 Memory interface IP core are
available now with user configurable IP cores available in ISE? Design Suite 13.4
in September 2012. Qualified Micron RLDRAM 3 memory devices are available now in
x18 and x36 organizations across all speed grades from 800 to 1066MHz. For
complete information visit: micron.com/rldram.
About Micron
Micron Technology, Inc. is one of the world's leading providers of advanced
semiconductor solutions. Through its worldwide operations, Micron manufactures
and markets a full range of DRAM, NAND and NOR flash memory, as well as other
innovative memory technologies, packaging solutions and semiconductor systems for
use in leading-edge computing, consumer, networking, embedded and mobile
products. Micron's common stock is traded on the NASDAQ under the MU symbol. To
learn more about Micron Technology, Inc., visit micron.com.
About Xilinx
Xilinx is the world's leading provider of programmable platforms. For more
information, visit: xilinx.com. |
