Monday November 24, 8:30 am Eastern Time
Company Press Release
SOURCE: Air Packaging Technologies, Inc.
Air Packaging Technologies, Inc. - Progress Report
VALENCIA, Calif., Nov. 24 /PRNewswire/ -- Air Packaging Technologies, Inc. (Nasdaq: AIRP - news; VSE: APT - news)
Through the sales efforts during the past 10 months Air Packaging Technologies, Inc. has received commitments for in excess of one million dollars in AIR BOX(R) products to be shipped in 1998. The sales efforts in the latter part of '97 and early '98 will lead to substantially more commitments for AIR BOX(R) products in '98 and beyond.
The SDS(TM) AIR BOX(R) is used to ship finished wafers to die cutting operations worldwide. This is the product developed and tested with Motorola during the last 4 years. With Motorola test results being accepted by the Semiconductor Industry in the Silicon Valley it has allowed APTI to proceed with 30 and 60 day pilot programs.
APTI has two sales representatives in the Silicone Valley presently working with 9 Semiconductor Companies controlling 76 Wafer Fabricating facilities. Pilot programs in the San Jose area will continue with several successfully completed and orders pending, and others in various stages of completion.
The pilot programs in the Medical and Dental fields are successfully completed and will lead to substantial business in 1998. Air Packaging Technologies, Inc. is presently working with the 3 leaders in the Medical and Dental Industries and expect to expand this focused effort early in '98.
Air Packaging Technologies, Inc.
Garvin McMinn,
President & CEO
SOURCE: Air Packaging Technologies, Inc. |
