BUSINESS WEEK MAGAZINE/DEC 1, 1997 Edition:
Written By: Catherine Arnst
"Developments to Watch"
Semicondutor wafers are becoming ever more delicate and valuable prompting the development of a new packaging technology that suspends wafers in a pressurized air bubble. The SDS AIR BOX, an alternative to foam and/or bubble wrap was developed by AIR PACKAGING TECHNOLOGIES, INC. of Valencia, CA. with help from MOTOROLA, Inc. AIR PACKAGING TECHNOLOGIES' President, Garivn McMinn, says air wrapping was conceived in the Mid-1980's as a novelty for gifts, but it took years of research to develop the AIR BOX's eight layered bag. The bubble, which looks like a thick zip-lock bag can hold its strength during air pressure changes and insulate against static electricity that can destroy delecate electronics.... |
