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Technology Stocks : Silicon Valley Group
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To: Bookdon who wrote (1326)11/25/1997 9:56:00 AM
From: FJB  Read Replies (2) of 2946
 
Hitachi has developed a semiconductor circuit electron beam direct drawing device which has three times the capability of conventional devices. It features a cell exposure method and an improved method of electron beam diffraction. It can also be applied to the printing of circuits with line widths under 0.15 microns. The new device uses advanced transfer diffraction technology which allows wide angle diffraction of electron beams with high precision. It enables exposure of up to 21 kinds of patterns during comprehensive transfer of the circuit patterns onto the wafer. It provides 1.4 times the conventional speed of transfer of circuit lines and other components, so that where about three 200 mm wafers could be processed in an hour now 10 wafers can be processed. The smallest line is 0.13 microns wide. The electron gun was also modified to better stand vibration.
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