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To: shane forbes who wrote (7977)	11/26/1997 9:20:00 AM
From: Moonray	Read Replies (2) of 25814

LSI Logic Introduces Mini-Ball-Grid Array and Chip-Scale Packages Cost Reduction and Miniaturization Goals Easily Met with New Range of Small Inexpensive ASIC and Standard Product Packages MILPITAS, Calif., Nov. 26 /PRNewswire/ -- LSI Logic announced today the addition of a miniature Chip-Scale package (CSP) family of chip packages today, capable of supporting very dense 0.8- and eventually 0.5-mm ball pitches or spacing between solder balls. Combined with these CSP entries, a Mini-Ball-Grid-Array (mini-BGA) offers a very inexpensive package choice for 1.0-mm ball pitch applications. These are the latest additions to LSI Logic's extensive line of packages tailored to the broadest range of applications. biz.yahoo.com o~~~ O

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