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Technology Stocks : General Lithography
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To: FJB who wrote (699)11/26/1997 2:02:00 PM
From: TheSpecialist  Read Replies (1) of 1305
 
RE: Is OPC technology universally used for 0.25 and under
photolithography? If not,why?

There are three levels of OPC. The first is line size biasing,
used to correct for linewidth differences between isolated and
dense geometries. The second is mild structural changes to the
designed geometry to correct for corner rounding, line end
shortening and linewidth differences (this is the type of
correction shown on the MicroUnity home page). The third level
is very aggressive structural changes to design to further the
correction capabilities of level 2.

The use of OPC is determined by the capability of lithography
equipment and processes. For example, a high numerical aperture DUV
stepper/scanner coupled with a high contrast resist would probably
use only minor line biasing (level 1 OPC) to meet the requirements
of a 0.25um process. However, if a fab is attempting to meet the
same requirements with a lower NA stepper/scanner and lower contrast
resist, then they might be forced to more agressively utilize higher
levels of OPC.

I think it is safe to say that level 1 OPC is used for all 0.25um
technologies and that the more aggressive levels will be used on a
case by case basis. It is also important to note that fabricating
masks and inspecting them with higher levels of OPC is a new and
difficult technology and this is being asked of an industry (mask)
that is having difficulty just making standard geometry masks.

Also, FYI, MicroUnity and a handful of other companies that sell
software to generate the OPC designs work only in the level 2 and 3
OPCs. Level 1 OPC is easily accomplished by the mask shops with a
standard chip design.

Hope this helps.
TS
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