Agree, although I think you should perhaps add a third element to the guessing...
According to the article in the link that Tumbleweed posted: Message 28386710 ?
"If you're familiar with the design of a Lumia 800 or 900, then you have a good sense of the 920 looks like. Except it's larger – much larger. And thicker and heavier. At a centimetre thick, the 920 truly is a formidably substantial slab."
"Curiously, I found it hot to the touch, on the back around the camera. This is where the Snapdragon S4 CPU – and the GPU – are located. While I wouldn't draw anything conclusive from this, and this is only a prototype, it would be remiss not to report it."
It goes on to report that the marketing will focus on imaging... blah, blah, blah... saying that imaging prowess is what it will be sold based on... low light function a key element.
And then it wraps the meat in that description with "Alas, the Minders leapt into Red Alert mode to prevent me transmitting the results, you'll have to take my word for it."
So, a couple of tech geek questions come to mind...
First, what would explain the problem of the hotspot... ? Perhaps... something not quite correctly engineered in the matching up of the chips, power, and the supporting designs in the prototype ? Power issues ? Design problems integrating the package with the heat ? That seems odd. Now, what would drive that as an issue ?
Two obvious potentials... one is that its an issue of a mismatch... only because the "real" plan isn't in silicon yet ? So, maybe the prototypes are using an jury rigged higher power consumption chip than what was planned ? Either because the plan isn't ready in actual silicon... or because they found the market is requiring that they needed to give us a chip with more capability than had been planned... just to prevent overwhelming disappointment.
That above... might also explain why the fraud in the marketing department... using faked images in the marketing materials making more sense if... they didn't have the actual capacity to deliver anything "real" at the point in time they were doing the work... so, there may be some "time to market" issues that are emerging, and made apparent in the aggregate...
The question for you, then, is, do you think they could fit a larger... if not 41MP chip in the dimensions of that package ? How thick is your 808 at the widest point, with that 41MP sensor ?
A geekier question would address the relative power consumption of the 8Mp, 20 something, and the 41MP... still requiring considering the CPU power issues in relative terms... versus the engineering of the heat management problems... But, how do the newer/larger/better generation GPU's compare in power density versus the older ones ?
Then, the second potential... if that first one is NOT what this is about... if there WAS a disconnect between "the plan" and what bits of silicon they have been able to make work with the new OS... if that forced them to change the silicon they were using in prototypes because of software integration issues... resulting in an new issue in the engineering tolerances in power and heat management being "stretched"... since they're using a "hot" chip ?
So...
Either the issue is one of "prototypeness"... that indicates we might see something better in the end...
Or, it indicates future lawsuits when people get burned and phones explode from exceeding power tolerances in the balance in the tradeoffs between power, performance, and heat... ?
And, there are still the time to market issues lurking in all of the above...
i'm not sure it will matter nearly as much if NOK delivers "better" function with more megapixels in a device that won't overheat or explode... given improved integration... if that means they'll not deliver it to market until March of 2013... |
