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To: S. Wallace Slough who wrote (703)	12/2/1997 8:55:00 PM
From: TheSpecialist	Read Replies (1) of 1305

The referenced article has NO impact on the use of DUV (both with KrF and the follow-on ArF) or Cymer. The use of e-beam direct write systems is accepted as a niche market product and is not meant for mainstream volume production of ICs. The mention of 10 wafers per hour is for contact layers which have an exposed area of ~1%. When you go to a gate, isolation, or interconnect layer the exposed area can increase to 50+%, which means a 50X reduction in throughput. This, along with MHO that no IC manufacturer would support the utilization and maintenance of two different tool sets to meet essentially the same imaging requirements. TS

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