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Technology Stocks : Asyst Technologies (ASYT) Good Value/Where is the Bottom?

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To: Paul Dieterich who wrote (579)12/5/1997 10:46:00 AM
From: Paul Dieterich  Read Replies (1) of 2313
 
300-mm cooperation continues to grow

A service of Semiconductor Business News, CMP Media Inc.
Story posted at 7:30 a.m. EST/4:30 a.m. PST, 12/5/97

By Jack Robertson

CHIBA, Japan -- The Japanese and Sematech-led 300-mm wafer camps continued to draw closer together with the signing of a new joint agreements to help speed the opening of next-generation IC production fabs using the larger diameter wafers.

During the Semicon Japan equipment conference here this week, the International 300-mm Initiative (I300I), based in Austin, Tex., and Japan's Selete (Semiconductor Leading Edge Technology Inc.) released new joint standards on metrics that will be used by both groups in qualifying and testing 300-mm equipment and tools.

The two consortia also initiated a framework to begin joint development of computer integrated manufacturing (CIM) standards for 300-mm fabs. These agreements are the latest reached between Selete and I300I, which have been viewed by many in the chip industry as competing efforts in 300-mm wafer technology. However, the two consortia began intensive efforts to cooperate last May and have been steadily making headway to share some of their work (see June 4 story).

I300I director Frank Robertson told a technical session at Semicon Japan that the two groups also are talking about joint standards for 300-mm fab environmental health and safety, communication protocols between tools and interchangeable components.
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