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To: Zeev Hed who wrote (11128)	12/6/1997 11:49:00 PM
From: FJB	Read Replies (2) of 25960

Zeev, The number of process steps for an advanced 0.35&#181 process is more than 300. isdmag.com Also there is some debate about whether mix and match will work since i-line systems may not be able to keep up with DUV systems. techweb.cmp.com Ideally, semiconductor makers want to hold down their capital costs by using the expensive UV step-and-scan systems to process only the critical layers and use existing i-line steppers for the larger number of non-critical layers. But unless the i-line tools have a comparable field size as the scanner, there is a "mix and mismatch" for making non-critical layers. Lastly, your estimate for DUV tool shipments for the next three years is 30% lower than the lowest estimate I've seen from research firms or major brokerages . Bob

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