Paul,
Good to see you back!
The following is from Japan Business Tech:
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Intel, NEC Give Details of 300mm Wafer Chip Lines
December 4, 1997 (TOKYO) -- Representatives of major IC makers and equipment manufacturers will provide details of their technology for 300mm wafer production at the Semi Technology Symposium.
The symposium coincides with Semicon Japan 97, an exhibition held from Dec. 3 to Dec. 5, 1997, at the Makuhari Messe in Chiba prefecture. Major IC makers are planning to start operating pilot lines for 300mm wafers in 1998 and production lines in 1999.
Intel Corp., which is at the forefront in research and development for 300mm wafers, will provide a perspective on its work. An Intel representative will give an address entitled "Factory Consideration for High Volume Manufacturing Using 300mm Wafers." Intel will build a pilot line in the second quarter of 1998 and production lines in 1999.
NEC Corp., which also is a leader in microchip technology, will give an address entitled "300mm Wafer Fab Forecast." NEC will set up a pilot line in the second quarter of 1998 and production lines in the fourth quarter of 1999.
Semiconductor Leading Edge Technologies, Inc. (Selete) , the research and development organization set up by 10 Japanese IC makers, will give a report at the symposium on the assessment of equipment and materials to be used in 300mm wafer production processes.
The Semi Technology Symposium comprises nine sessions, including the 300mm wafer session. Others are: (1) test methodology for high-speed 1GHz-ICs, (2) the next-generation lithography technology for the post-0.25-mm rule, and (3) environment and safety measures.
Related story : New Devices for Making 0.18-micron Wafers at Show
japanbiztech.com:80/articles/JPEL971204NBO001P0T0F0.html
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