SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Lightwave Logic, Inc.
LWLG 4.720+3.1%Oct 31 9:30 AM EDT

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
From: Paul Lee3/6/2014 11:34:07 AM
1 Recommendation

Recommended By
Zoro99

  Read Replies (1) of 1811
 

Lightwave Logic Begins the Manufacture of a Multi Integrated Nanophotonic Transceiver (MINT) Prototype to Address Explosive Data Center Growth
Company to Incorporate Proprietary High Power Nonlinear Organic Polymers (NLOPs) to Increase Performance at Reduced Cost
Has Released Completed Chip Design to OpSIS, Inc., for Fabrication on Silicon Wafers





LONGMONT, Colo., March 6, 2014 /PRNewswire/ -- Lightwave Logic, Inc. ( LWLG), a technology company focused on the development of Next Generation Photonic Devices and Non-Linear Optical Polymer Materials Systems for applications in high speed fiber-optic data communications and optical computing, announced today that it has begun the process of manufacturing its advanced design Silicon Organic Hybrid Transceiver prototype and has released the completed chip design to OpSIS Inc., who will be producing initial silicon wafers. Delivery of the wafers is expected in early summer.



A Multi Integrated Nanophotonic Transceiver is a communications device that both transmits and receives data--addressing a serious need in telecom and datacom applications. The integration of NLOPs could dramatically increase data rates; decrease both manufacturing and operating costs and minimize power consumption. More importantly, it is a multi-channel device capable of transmitting many channels on the same fiber and exceeding 100 Gb/s data throughput.

A recent study by IBM stated that 70% of all mid-sized business have employed cloud-based solutions and several industry experts have estimated that over 2.5 quintillion bits of data are being created and accessed every day. This number continues to expand, pushed by the growth of on-demand movies, picture storage and messaging. There is enormous potential demand for 100 Gb/s transceivers, which has been hampered by a very high cost that approximates several thousand dollars per device. This is due to the current 4 x 25 Gb/s configuration that is limited by the inherent properties of inorganic materials.

Tom Zelibor, Chairman and Chief Executive Officer of Lightwave Logic stated, "We are pleased to begin the manufacture of this important, timely device that addresses the needs of data centers around the world. The unique design of this transceiver has been in the works for quite some time and I am glad to see it taking shape into a functioning device.

"Our organic polymer-based solution is intended to meet the demand for low cost, low power 100 Gb/s interconnections that can offer one multi-channel device at a fraction of the cost of current 4 x 25 Gb/s solutions. Over and above a lower acquisition cost, organic polymers emit less heat; require less error correction, and run on dramatically reduced voltage to offer a compelling combination of features and benefits to address the specific and pressing needs of both data communications and telecommunications industries. Furthermore, organic polymer-based devices offer a pathway of continuous improvement due to an open molecular architecture that can be altered to improve characteristics.

"OpSIS will be providing us with wafers that will each contain hundreds of devices we will process with various combinations of our electro-optic polymer systems. This initial application will target inter-data center interconnections of more than 10 kilometers. Our next design will utilize a different wavelength and address the current bottleneck in the rack-to-server layer. The movement of information within an individual data center is many times larger than what actually enters and leaves."
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext