Formerly About Advanced Micro Devices Message Board

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Politics : Formerly About Advanced Micro Devices

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To: Elmer who wrote (26707)	12/13/1997 9:27:00 AM
From: Bill Jackson	Read Replies (1) of 1576022

Elmer; Thanks for the response, I know the smaller devices can be fully tested before packaging, and I has felt that they would test the CPUs that way prior to packaging, as the packages are very costly. I have seen these multiple finger test jigs being used on entire wafers, touching the pads for testing, and then advancing to the next die. Is this just a quick go/nogo test for CPUs such as these, to winnow the candidates prior to full packaging? I would think they would be able to make a single die tester that would be able to at least determine if they had a fully functioning device after the on wafer testing had cut down the numbers. Bill

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