Formerly About Advanced Micro Devices Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Advanced Micro Devices

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: Bill Jackson who wrote (26715)	12/13/1997 11:58:00 AM
From: Elmer	Read Replies (1) of 1575738

< I know the smaller devices can be fully tested before packaging, and I has felt that they would test the CPUs that way prior to packaging, as the packages are very costly.> They can and do. It's called wafer sort. <Is this just a quick go/nogo test for CPUs such as these, to winnow the candidates prior to full packaging?> No, it's quite thorough. CPU packaging costs are high and because of their size, the % of bad die is high, compared to smaller devices. Idealy, a company wants the number of sellable packaged parts to be as close to 100% as possible. There are some things though that can only be reliably tested on a packaged part. Speedbinning is one but not the only thing. EP

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next