It sounds like they have a new market for an old product. I never heard of "silicon interposers"
Ultratech Receives Multiple System Order To Support Major Asian OSAT Expansion Ultratech's AP300
Lithography Platform Chosen for Next-Generation Advanced Packaging Applications
SAN JOSE, Calif., Feb. 9, 2016 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK ), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has received a multiple system order from a leading outsourced semiconductor assembly and test (OSAT) company. Ultratech's AP300E lithography systems will be utilized for various advanced packaging applications including copper pillar, wafer-level packaging (WLP) and emerging technologies including fan-out WLP and silicon interposers to support growth driven by mobile devices.
Ultratech General Manager and Vice President of Lithography Products Rezwan Lateef stated, "Recently a number of companies have been investigating reduction steppers for use in advanced packaging applications. Based on that information, this customer performed a comprehensive side-by-side onsite evaluation and found that Ultratech's Unity AP300E stepper demonstrated superior imaging performance and lower cost of ownership for volume production. Specifically, our system provided a larger depth-of-focus (DOF) and nearly perfect vertical sidewall angles for copper pillar applications, and demonstrated superior extendibility for next-generation, fine-pitch, fan-out WLP applications. The competition simply could not meet these stringent process requirements. We are very pleased to support the expansion efforts for this major OSAT, and look forward to working with them on developing the next generation of advanced packaging applications."
The Ultratech AP300 Family of Lithography Steppers
The AP300 family of lithography systems is built on Ultratech's customizable Unity Platform™, delivering superior overlay, resolution and side wall profile performance and enabling highly-automated and cost-effective manufacturing. These systems are particularly well suited for copper pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. In addition, the platform has numerous application-specific product features to enable next-generation packaging techniques, such as Ultratech's award winning dual-side alignment (DSA) system, utilized around the world in volume production.
yadda yadda To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/ultratech-receives-multiple-system-order-to-support-major-asian-osat-expansion-300216970.html
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