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Technology Stocks : AMD, ARMH, INTC, NVDA

AMD 242.25

-1.8%

12:57 PM EST

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To: fastpathguru who wrote (16107)	6/2/2016 11:02:35 AM
From: engineer	Read Replies (1) of 72389

I think it is far more advanced on silicon interposers than you think. An Interposer is nothing more than a 4-6 layer silicon device with HUGE metal lines. Not hard to make, can be done in an old retired 65nm line quite cost efficiently. Interposers will become the circuit boards of the future, mixing different processes and feature sizes on a single device. This way you can rev part of your design and leave the other part alone, such as reving the AP processor part and leave the Modem alone. Or upgrade memory in the part without a complete mask spin, just a new interposer. For power, it will reduce the chip to chip power by a lot, but not as much as a monolithic die can do, however as we go forward, I see less and less of die shrink as opposed to lower power or faster speed. Stacking die is already being done in volume and this will become so common place that in 3 years, all the cell phone chips will probably have gone this way. FLASH, DRAM, and SRAMS have already gone this path.

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