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Technology Stocks : AMD, ARMH, INTC, NVDA
AMD 246.76-0.5%Nov 14 9:30 AM EST
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To: Vattila who wrote (16110)6/2/2016 12:44:04 PM
From: rzborusaRead Replies (1) of 72374
 
According to the info I can find with a quick search, the GP104 die in GeForce GX 1080 (and presumably 1070) is estimated (by videocardz.com) to be ~333 mm², while the Polaris 10 die in Radeon RX 480 is estimated to be ~234 mm². Can anyone speak to the yield and cost advantage of Polaris, assuming equivalent process?
My simple layman understanding of this: There will be a number of defects per wafer. These will be distributed over the number of die. To compare effects for different die sizes go directly to the die count per wafer. The one benefit of larger die is one die is more likely to absorb multiple defects. But, it is all about averages. HTH Oh, there is 333/234=1.42. And it probably would be even higher than 1.42 given the edge loss, round wafer and rectangular die. So my wag would be almost 50% more candidate parts. I welcome correction.
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