Formerly About Advanced Micro Devices Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Advanced Micro Devices

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: Petz who wrote (27638)	1/5/1998 10:14:00 AM
From: Time Traveler	Read Replies (1) of 1572942

Petz, Welcome back from your vacation, again. As I remember you just came back from Mexico a month or two ago. Where did you go this time? Now, let's get down to business, shall we? "Does the slot 1 design pull heat from the bottom of the die, or is the improved cooling simply the result of lower case-to-ambient thermal constant?" Since 0.35um Slot I does not have this flip-chip technology, I would have to say it is pulling heat from the bottom of the die. At 0.25um, Intel is using flip-chip (correct me if I am wrong here, Paul, Elmer, or Yousef) --- heat would be channeled through the top of the die. Does it make any difference? The improved cooling capability of Slot I by definition in engineering language has lower case-to-ambient thermal constant. John.

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next