To all,
No one has woken up in this thread this year, ?
There is a news on Electronic News today as follows:
SIEMENS, MOTOROLA MARRY 300MM RACE FORTUNES -- Today in Dresden, Germany at its sparkling plant on the abandoned site of a Soviet military base, Siemens AG detailed its new "Semiconductor 300" joint venture with Motorola Corp. To the roughly $200M in subsidies from
the Free State of Saxony and from the German federal government, Siemens Microelectronics and Motorola Semiconductor Products Sector (SPS) will add about $400M before 2000 to engineer a volume, 0.25 micron 300mm wafer production line at Siemens Microelectronics Center Dresden. The line fills the fab; it occupies the final one-fourth of the two-year plant constructed in 1995, though Siemens has cleared land just adjacent to the building. Semiconductor 300, like their older White Oak Semiconductor collaboration for DRAMs, will be a separate legal entity whose employees do not work for either company. Initially, 25 Siemens engineers will transfer into the JV, as will the same number from SPS Austin, Texas. Which equipment suppliers the two will use was the day's stickiest question. Executives revealed that a 300mm Canon lithography stepper (of which there are only five existing) has been installed and also that the successor to the standard mechanical interface (SMIF) mini-environment, the front opening unified pod (FOUP), will be the wafer carrier used. Siemens plans to make more DRAMs on the lines; Motorola plans to make logic products.
Does anyone know that if the (FOUR) SMIF pod is supplied by ASYT?
Thanks, |
