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To: Mr. Aloha who wrote ()	1/15/1998 1:15:00 PM
From: Paul Dieterich	Read Replies (1) of 582

I think this Canon/Intel news from 1/12 was posted somewhere: (http://www.sumnet.com/enews/columns/fab011298.html) Canon USA, Inc. revealed last week that its 300-millimeter PA-3000EX3L deep-ultraviolet (DUV) wafer stepper became operational at the International 300mm Initiative (I300I) facility in Austin, Texas. The company also revealed that the new stepper has been accepted by I300I and Intel following a successful performance test in which the EX3L exposed more than 1,500 12-inch wafers without failure. Due to the consortium's limited funding, Intel purchased the machine for use by I300I under a one-year contract that will allow sharing of resulting data with all member companies. Intel will also develop its own exclusive processes on the stepper. Earlier this year, Selete, a 300mm development consortium of Japanese major IC manufacturers including new member Samsung of Korea, installed a Canon EX3L at its facility. Two Selete and I300I member companies also have Canon FPA-3000EX3L steppers in place; these companies were not named.

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