Samsung Foundry Certifies ANSYS Multiphysics Simulation Solutions For Multi-Die Integration Advanced Packaging Technology
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"Samsung Foundry and ANSYS' advanced packaging reference flows for MDI empower our mutual customers to achieve improved power, performance and area requirements, as well as cost and turn-around time reduction through accurate analysis of complex interconnections across the chip, package and board," said Jung Yun Choi, vice president, foundry design technology team at Samsung Electronics. "ANSYS provides comprehensive chip-package-system co-analysis workflows for addressing complex multiphysics challenges of extraction, power and signal electromigration, thermal-induced stress, signal integrity and reliability in 2.5D/3D-IC packaging technologies."
"2.5D/3D-ICs for AI, networking, 5G, automotive and HPC applications are extremely complex and require comprehensive multiphysics analysis to maximize performance," said Vic Kulkarni, vice president, strategy, semiconductor business unit at ANSYS. "Leveraging ANSYS multiphysics solutions for Samsung MDI enables mutual customers to achieve silicon to system success and accelerate time to market, while reducing costs through smaller form factors." |
