ASE Group Significantly Advances Semiconductor Packaging Development With ANSYS Customization Toolkit Solution
investors.ansys.com
"ASE is committed to constructing a complete solution for developing IC packaging technology, strengthening design and high-yield manufacturing," said C.P. Hung, vice president, corporate R&D, ASE Group. "We are very pleased to have a long-term collaboration with ANSYS. The automated analysis technology developed by ACT is the first step in developing future intelligent analysis and design, converting converse complex manual analysis into an automatic search process for potentially critical areas such as cracking, interface delamination and more. ACT will bring more opportunities for advanced packaging and system-level design to the market and accelerate customer product launches."
"ASE's ACT solution provides a simple and highly intuitive development environment, enabling engineers to effectively use existing simulation tools to radically increase their productivity and take their IC packaging and development process to the next level," said John Lee, vice president and general manager, ANSYS. "Spanning a product's entire lifecycle, ASE's ACT automated workflow creates game-changing breakthroughs in semiconductor packaging processes to deliver unparalleled customer support." |
