Purloined from AOL MF:
Subject: Annual Meeting
From: kidschelin@aol.com (KidSchelin)
Date: 23 Jan 1998 14:38:03 EST
I attended the annual meeting yesterday. It was very upbeat. They are very excited about the prospects for their new HIF, (Head Interconnect Flex), technology. The head of the Litchfield Subsidiary, (can't remember his name), was there and gave a presentation. He said they are very encouraged by the growing interest from many customers in their flex technolgy which applies not only to disk head interconects but the new chip packages, (including,
but not limited to "flip chips"), as well. Relative to HIF, some asked him to comment on a rumor that HIF, although less expensive to aquire, did not give as good yields as Hutcheson's new techology, and therefore may be more expensive overall. He said that their experiance with yields with Seagate on their new high end Cheeta drive has been very good, even better than expected. He said high yields is one of the strengths of the techology. He also
said, though, that no one has direct comparative evidence on how the two technologies stack up because no one customer has programs with both. Both he and the CEO reiterated , however, that they were absolutely convinced of the superiority of their product, both in cost and yield, to the competition and that they're in a very good position, with their new plant, to meet demand.
In a different matter, some one asked if they get any benefit from the Asian currency devaluations and the CEO said no. All their dealing are in dollars. He did make the point, however, that the devaluations should help them greatly as they renew contracts with their Asian partners.
Geo. |
