AMCC's SONET Transceivers Chosen by 3Com;
Industry-Leading Transceivers Enable Next-Generation
Network Switching Solutions
04:12 p.m Jan 23, 1998 Eastern
SAN DIEGO--(BUSINESS WIRE)--Jan. 23, 1998--Applied Micro
Circuits Corp.(Nasdaq:AMCC) Friday announced that 3Com Corp.
has selected AMCC's SONET transceivers for use in the
company's CoreBuilder 7000 high function switch and
CoreBuilder 9000 enterprise switch for ATM and Gigabit
Ethernet high capacity backbone networks.
AMCC's S3028 SONET/SDH/STM transceiver and S3027 clock and
data recovery unit are used to support SONET OC-12
(622.08 Mbps) data transmission in 3Com's CoreBuilder 7000
high-function switch, which supports data throughput
of up to 5 Gbps, and CoreBuilder 9000 enterprise switch,
which supports unprecedented throughput up to 100 Gbps.
In addition, AMCC's S3029 155 Mbps quad transceiver is used
for the CoreBuilder 9000 enterprise switch's OC-3 (155 Mbps)
solution. The AMCC devices provide superior jitter
performance, combined with low price, low power consumption
and small packages.
"Our high-end switching systems offer new levels of network
capacity and are designed to support next-generation
applications," said Yaki Luzon, product manager for 3Com.
"We selected AMCC's transceivers for their excellent
performance and superior jitter characteristics, which make
it easier for our designers to meet overall system jitter
requirements."
"3Com's selection of our S3027/28/29 SONET transceivers is
a further indication of the high level of performance
provided by these devices," said Ken Prentiss, AMCC's
product marketing manager for SONET/SDH/ATM. "We look
forward to our continued relationship with 3Com, supplying
key components that support the industry-leading performance
of their networking solutions."
3Com's CoreBuilder 9000 enterprise switch, which was
announced last fall, defines a new class of high-end
switching systems for ATM and Gigabit Ethernet high
capacity backbone networks. This innovative, multilayer
switch offers unprecedented levels of network capacity up
to four times that of competing products with the control
and the high system availability required for the core of
enterprise networks.
The CoreBuilder 9000 enterprise switch's bandwidth
management features include support for Layer 3 switching,
Fast IP, and MPOA cut-through routing techniques,
multicast/broadcast controls, traffic management, and
congestion control features which enable efficient network
bandwidth utilization. Advanced QoS/CoS features available
in the system enable customers to support mission-critical
or delay-sensitive applications, such as voice and video.
3Com's CoreBuilder 7000 high-function ATM switch enables
customers to scale the performance of their networks up to
622 Mbps of bandwidth in the backbone, support multimedia
applications with quality of service (QoS), and integrate
Fast Ethernet/Ethernet for the most cost-effective solution.
Based on the ATM Forum standards, this ATM switch delivers
the high speed and reliability that enterprises need for
business applications, such as videoconferencing and
convergence of voice and data. While the CoreBuilder 9000
switch will deliver up to 100 Gbps, the CoreBuilder 7000
switch delivers up to 5.0 Gbps as the switching engine. It
is a key part of 3Com's migration strategy for customers.
As the bandwidth demands increase in an enterprise, the
CoreBuilder 7000 switch can be migrated to the edge of the
network and the CoreBuilder 9000 enterprise switch can then
be installed in the backbone.
AMCC's S3028 transceiver combines superior jitter
performance with low price and low power consumption in a
single 14mm square package that enables designers to
significantly cut the total system costs for WAN and LAN
fiber interconnect equipment. The S3028 chip supports both
the SONET OC-12 and OC-3 WAN/LAN interface standards,
allowing designers to develop a single piece of equipment
that can support both rates.
It fully integrates all serialization/deserialization
circuitry in conformance with SONET/SDH/ATM transmission
standards, and is part of a total SONET/SDH/ATM solution
from AMCC that includes the company's family of clock
recovery devices.
In the 3Com application, the S3028 is used in conjunction
with AMCC's S3027 Clock Recovery Device as the interface
between the network controller and the fiber optic module.
The low jitter PECL interface of both devices ensures
compliance with the bit-error rate requirements of the
Bellcore, ANSI and ITU-T standards. Because the jitter
generation of the S3028 exceeds the ITU-T requirements
over all frequencies, it enables the system designer to
more easily meet overall system jitter requirements,
including the optical interface devices.
The function of the S3027 clock recovery unit is to derive
high speed timing signals for SONET/SDH-based network
equipment. Implemented with AMCC's proven Phase Locked
Loop (PLL) technology, the S3027 receives either an
OC-12/STM-4 or OC-3/STM-1 scrambled Non-Return to Zero
(NRZ) signal and recovers the clock from the data. The
chip outputs a differential PECL bit clock and retimed
data.
AMCC's S3029 OC-3 quad transceiver is used in 3Com's high
bandwidth CoreBuilder 9000 enterprise switch to support
155 Mbps data transmission. The function of the S3029 clock
synthesis and recovery unit is to derive high speed timing
signals for SONET/SDH-based equipment. The S3029 receives
four OC-3/STM-1 scrambled NRZ signals and recovers the
clock from the data to generate a 155 MHz transmit clock.
The chip outputs a differential PECL bit clock and four
retimed data streams.
AMCC introduced the industry's first SONET/SDH/ATM chipset
in 1992, and released a more highly-integrated successor
to that chipset in 1994. The S3027/28/29 devices are part
of AMCC's third-generation SONET solution, which breaks
new ground in performance, integration, low price, reduced
power consumption, and smaller packaging.
AMCC is a premier supplier of high-bandwidth silicon
connectivity for the world's communication infrastructure.
The company utilizes its world class expertise in
mixed-signal design and multiple silicon process
technologies to provide high performance silicon solutions
for SONET, ATM, Gigabit Ethernet and Fibre Channel markets.
AMCC's core technologies also address ATE and high-speed
computing needs. AMCC's corporate headquarters and wafer
fabrication facilities are located in San Diego. Sales and
consulting engineering offices are located throughout the
world.
For further information regarding AMCC and its products,
write: Marketing Communication Department, AMCC, 6290
Sequence Drive, San Diego, Calif.
92121-4358; or call 800/755-AMCC (800/755-2622) or
619/450-9333 or fax 619/450-9885; or e-mail nwpr@amcc.com;
or visit the company's Web site at amcc.com .
3Com Corp. enables individuals and organizations worldwide
to communicate and share information and resources at
anytime from anywhere. As one of the world's preeminent
suppliers of data, voice and video communications
technology, 3Com has delivered networking solutions to
more than 100 million customers worldwide.
The company provides enterprises, network service providers
and carriers, small businesses and consumers with
comprehensive, innovative information access products and
system solutions for building intelligent, reliable and
high performance local and wide area networks. 3Com has
worldwide revenues of approximately $6 billion and employs
about 13,200 employees in 45 countries. For further
information, visit 3Com's World Wide Web site at
3com.com, or the press site at
3com.com .
Except for historical information contained herein, the
matters set forth in this news release are forward-looking
statements that are subject to certain risks and
uncertainties that could cause actual results to differ
materially from those set forth in the forward looking
statements, including such factors as the rescheduling or
cancellation of orders by customers; fluctuations in the
timing and amount of customer requests for product
shipments; fluctuations in manufacturing yields and
inventory levels; changes in product mix; the company's
ability to introduce new products and technologies on a
timely basis; the introduction of products and technologies
by the company's competitors; the availability of external
foundry capacity, purchase parts, and raw materials;
competitive pressures on selling prices, the timing of
investments in research and development; market acceptance
of the company's and its customers' products; the timing of
depreciation and other expenses to be incurred by the
company in connection with the expansion of its existing
manufacturing facility and in connection with its proposed
new manufacturing facility; the timing and amount of
recruiting and relocation expenses, prototyping costs and
promotional expenses; costs associated with future
litigation, if any, including without limitation, litigation
relating to the use or ownership of intellectual property;
costs associated with compliance with applicable
environmental regulations; general semiconductor industry
conditions; and general economic conditions, and the risk
factors that are detailed in the Final Prospectus, dated
Nov. 25, 1997, relating to the recent initial public
offering of the company's common stock and the company's
other filings with the Securities and Exchange Commission.
AMCC is a registered trademark of Applied Micro Circuits
Corp. 3Com is a registered trademark and CoreBuilder is a
trademark of 3Com Corp. (See also:
businesswire.com)
Ahhh, I see, the Web is not all done with magic after all.
o~~~ O |
