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Technology Stocks : AMD, ARMH, INTC, NVDA

AMD 213.43

+6.2%

Dec 19 9:30 AM EST

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To: neolib who wrote (35288)	2/21/2020 4:39:13 PM
From: Vattila	Read Replies (2) of 73044

> Digitimes must have coronovirus: "Demand for AMD's new 7nm EUV processors remains robust..." I guess by "demand for" it is here meant "interest and investment in", which would be a good sign, considering all the FUD around at the moment. I like this: "development projects for the chips commenced by PC, motherboard and graphics card makers this year set to be 10-20% higher than the levels in 2019, according to industry sources." Speaking of AMD's next generation: TSMC teases new AMD Zen 3 chiplet packaging details “in the coming months” "During a recent Meet the Experts briefing between TSMC and AMD execs, TSMC’s Godfrey Cheng tantalisingly teased that alongside Ryzen 4000’s 7nm+ process node there would also be advancements to the chiplet packaging design being announced soon." pcgamesn.com I have speculated that Zen 3 will bring the era of the interposer to mainstream CPU packaging. However, AMD's presentation at ISSCC has this slide, which hints about "reach" problems with the interposer approach. I wonder if they have overcome this now. I presume they ideally would like to use an interposer to reduce power consumption of the interconnect, and increase density, allowing further core-count increase. pc.watch.impress.co.jp See many more interesting slides and comments at the PC Watch link above.

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