Mason,
It appeared you were focused on technical aspects slowing DUV implementation, when in fact you were also considering SEA. Now I understand and agree, but the SEA and Japan thing is ancient news at this point.
RE:And to stray off on a tangent, how much are Asian DRAM shops,
one of Nikon's principal DUV target markets, going to need a stepper with a 22mm field in a year or two? I doubt they'll want them for 256mb fabs, I don't know, I'm asking -- are they suitable for 64's, even?
Yes, you can image four 64Mb DRAM with a 22mm square field. The stepper could later be used for non-critical layers in the production of 256Mb DRAM.
RE:And one other thing on my alleged mind -- there is a tiny question mark in my mind, expected difficulties in implementing DUV to commercial .25um production, about whether this progression of steps (.18 then .13 then .10 and so on) is going to happen at all,
I think you are failing to fully consider how early we are in the ramp. Just apply the learning curve here. As far as going to 0.18, 0.15, etc. - we are going there, as sure as Clinton likes the ladies. <G>
Bob
BTW, I was looking for copper chip info at IBM research and I'm getting a lot server not responding messages. Can you take a look at
research.ibm.com and see if it works for you? |
