Duane... You're a one man posting machine here!
One thing I would like to get some opinion on... relating to earlier posts on the move from DRAM to ASIC production and mask requirements.
DRAM has become a commodity item. One of relative low complexity (as far as IC production is concerned) and high volume. Even know the complexity of these chips is rising to get more memory per chip, they are still low complexity, with minimal variation, and high volume production.
ASICS on the other hand tend to be very high complexity, low to medium volume production, with a large variety of designs. This would lead to higher margin type of masks, with more styles needed to support the various production of different ASIC types. This is especially true if mask capabilities, moving to the more complex requirements, are supported by the capabilities of fewer companies (such as DPMI).
I hope my prior statements weren't too confusing, but my question would be...
Given my comments, why would mask volumes go down with the move from more DRAM to more ASIC production? It seems to me that more masks would be required, due to increased varieties. Also, with the increase in mask varieties, more complex masks which would create higher profit margins for the mask makers with the capability to actually make the increasingly complex masks.
Any comments? What am I missing?
DJ |
