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Technology Stocks : Disk Drive Sector Discussion Forum
WDC 163.58+0.2%Dec 1 3:59 PM EST

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To: Stitch who wrote (2513)2/23/1998 7:47:00 PM
From: Mark Oliver  Read Replies (1) of 9256
 
Stitch, I agree with you that assembly of HGA and HSA's are labor intensive, but maybe I misread the press release because I was thinking IBM would build a wafer fab in China, which would seem to be very equipment intensive vs labor. If they plan to simply do assembly, it makes perfect sense.

The question of setting up a wafer fab in China seems to be questonable to me.

Do you find all head manufacturers make HGA's and HSA's?

When MR heads were new, I had read that there was a lot of waste of suspensions because heads could only be tested once assembled. If the head was no good, the whole suspension was lost as it cost too much to take them apart and reassemble with a new head. As MR technology improved, this waste was less. This seems to have left some component suppliers with less demand as this wastage falls. Would you agree with this?

Regards,

Mark
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