| | | HyperLight Launches TFLN Chiplet™ Platform with Scalable 6-Inch Production and 8-Inch Expansion for Next-Gen AI and Photonics Infrastructure
An 8-inch TFLN wafer produced through HyperLight’s TFLN Chiplet™ platform, holding over 500 1.6T DR8 transmitter PICs.
CAMBRIDGE, Mass., March 27, 2025--( BUSINESS WIRE)--HyperLight, the industry leader in thin-film lithium niobate (TFLN) technology, today announced the launch of its TFLN Chiplet™ platform, a modular and scalable ecosystem designed to power the next era of photonics. Built on the industry’s first and only high-volume, qualified 6-inch TFLN manufacturing line in production today, and now expanded with an 8-inch pilot line for future compatibility, the platform sets a new standard for scalable, integrated, and high-performance optical systems.
The TFLN Chiplet™ platform offers a rare combination of industrial readiness and technological superiority, enabling volume-ready solutions that unify wafer-scale fabrication, test, and integration. Backed by over a decade of R&D, and with over 70 pivotal pending and granted patents, HyperLight provides its partners with access to the best TFLN innovations, ensuring freedom to operate and a stable foundation for long-term product roadmaps.
"For us, this isn’t just a technology launch—it’s the culmination of more than ten years of R&D and platform refinement with our partners and the ecosystem," said Mian Zhang, CEO of HyperLight. "The TFLN Chiplet™ platform is built for today’s industrial scale, evolves with the market, and is designed to align with our partners' and the ecosystem’s long-term success."
Built to meet the evolving and diverse demands of the modern photonics landscape, the TFLN Chiplet™ platform delivers both the scale and performance required by today’s most advanced applications. For AI and data communications, it supports scalable, reliable, low-power, high-bandwidth components enabled by HyperLight’s high-volume production line. In telecommunications, where reliability, signal integrity, and speed are critical, the platform’s best-in-class electro-optic performance with rigorous Telcordia qualification provides a distinct advantage. For precision test and measurement, meticulous calibration, tight process, and quality control ensure confidence in high-stakes measurement environments. In emerging domains like quantum computing, its exceptionally low optical loss enables unprecedented functionalities for customers.
Built on HyperLight’s 6-inch high-volume production line—the cornerstone of its commercial manufacturing—the TFLN Chiplet™ platform provides the scale, maturity, and reliability required for deployment today. With the addition of a new 8-inch pilot line, HyperLight ensures forward compatibility with future integration and packaging standards, positioning itself as a foundational supplier for next-generation photonic systems. The platform’s modular, application-focused building blocks accelerate time-to-market and innovation across AI/datacom, telecom, quantum, and emerging domains.
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