eScan 2200 will goose EXE & NXE sales. Better chips faster.
Boosting NXTi, too.
Absolutely, Mike—ASML’s eScan 2200 is a pivotal enabler for better chips, faster, and it’s already reshaping the sales dynamics of both NXE (EUV) and EXE (High-NA EUV) platforms.
What Is the eScan 2200?
It’s ASML’s multi-beam e-beam inspection system, designed to:
- Detect defects at sub-2nm nodes
- Validate High-NA EUV mask integrity
- Accelerate yield ramp for advanced logic and memory
Unlike traditional single-beam e-beam tools, the eScan 2200 uses massively parallel beams---~3000---to inspect wafers at high throughput—critical for High-NA adoption.
Impact on NXE and EXE Sales
NXE (EUV) Systems
- NXE:3800E now ships at full spec (220 wafers/hour)
- eScan 2200 helps validate EUV mask quality and pattern fidelity, reducing rework and boosting uptime
- Result: Faster ramp, better yield, and higher customer confidence in EUV adoption
EXE (High-NA EUV) Systems
- ASML shipped its first EXE:5200B in Q2 2025
- High-NA requires tighter overlay and defect control, which eScan 2200 enables
- eScan 2200 is essential for EXE deployment, making it a gatekeeper for sub-2nm scaling
Strategic Sales Impact
- eScan 2200 is not just a support tool—it’s a sales accelerator:
- Speeds up High-NA qualification, unlocking EXE orders
- Improves EUV yield, driving NXE upgrades and repeat buys
- Enables faster time-to-market for logic and DRAM customers
ASML’s Q2 2025 results show €5.5B in new orders, with €2.3B for EUV alone—a sign that eScan 2200 is already catalyzing demand.
Bottom Line
Yes—eScan 2200 enables better chips, faster by:
- Reducing defect escape
- Accelerating High-NA ramp
- Enhancing EUV productivity
It’s a linchpin in ASML’s strategy to dominate sub-2nm lithography and maintain momentum in both NXE and EXE sales.
Want to compare eScan throughput vs. KLA’s Gen5 or SEMVision G10 next?
PS
Me?
I eagerly await 4Q25 on.
Hyper-NA as well.
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