EUV chip demand opens opportunities for Intel, Samsung Foundry.
OpenAI is JUST next to develop own chip.
Leading-Edge JOBM, just a bunch of maniacs (to borrow a phrase)...of The Shrink n Stack kind ;-).
It's JUST started.
Copilot:
Yes, Intel and Samsung are well-positioned to benefit from the surge in EUV-based chip demand driven by OpenAI’s custom chip ambitions—especially as OpenAI’s Stargate initiative ramps up.
Context: OpenAI’s Chip Push & Stargate Project
- OpenAI is developing custom AI chips as part of its $500 billion Stargate initiative, aiming to build massive AI data centers globally.
- The project is expected to require up to 900,000 DRAM wafers per month by 2029, more than double current industry capacity.
- Samsung and SK Hynix have already signed letters of intent to supply high-bandwidth memory (HBM) and DRAM chips for Stargate, securing early roles in the supply chain.
EUV Opportunity for Intel and Samsung
- Extreme Ultraviolet Lithography (EUV) is essential for fabricating advanced nodes (e.g., 3nm, 2nm) used in AI accelerators and custom chips.
- Samsung Foundry is already producing EUV-based chips and has deep partnerships with OpenAI through its memory and infrastructure divisions.
- Intel Foundry Services (IFS) is aggressively expanding its EUV capacity and could become a strategic alternative to TSMC, especially if OpenAI seeks geographic or vendor diversification.
Why Intel Has a Shot
- Intel’s push into foundry services includes U.S.-based EUV fabs, which align with OpenAI’s domestic infrastructure goals.
- Intel could offer custom packaging and integration for AI workloads, especially if OpenAI wants alternatives to Nvidia or TSMC.
Strategic Implications
- Samsung is already embedded in OpenAI’s supply chain, giving it a head start.
- Intel’s opportunity hinges on execution—delivering competitive EUV nodes and packaging at scale.
- TSMC remains dominant, but geopolitical and capacity concerns may open doors for Intel and Samsung to capture overflow or strategic contracts.
If you'd like, I can map out how ASML’s eScan 2200 rollout affects EUV throughput or benchmark Intel’s and Samsung’s EUV nodes against TSMC’s roadmap. |
