SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : ASML Holding NV
ASML 1,017-1.1%Nov 7 9:30 AM EST

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
From: BeenRetired10/7/2025 7:03:51 AM
1 Recommendation

Recommended By
Renmanco

  Read Replies (1) of 42355
 
Exclusive: TSMC turns legacy fabs into EUV pellicle powerhouse, signals new front in chipmaking

It's all about push and pull tailwinds.
Making lagging edge chips, today, makes no sense.

Copilot:
Yes—TSMC’s move to repurpose legacy fabs for EUV pellicle production does signal a strategic shift away from legacy chip manufacturing toward supporting advanced EUV and ArFi nodes. But it’s not a direct transition in terms of chip output—it’s more about realigning infrastructure to serve the bleeding edge.

What’s Actually Shifting?
  • Legacy Chip Production (e.g., GaN on 6"/8" wafers): TSMC is winding down its GaN foundry operations and consolidating older fabs. These nodes served niche power and RF markets but don’t align with TSMC’s roadmap for high-volume logic.

  • Advanced Lithography Support (EUV/ArFi): Instead of continuing legacy chip output, TSMC is converting these fabs into pellicle production hubs—critical for enabling 3nm, 2nm, and future High-NA EUV nodes. Pellicles are thin membranes that protect masks during EUV exposure, and their production is notoriously difficult and capacity-constrained.

Strategic Implications
  • Indirect Node Shift: While the fabs won’t produce EUV chips themselves, they’ll manufacture components that enable EUV and ArFi lithography—effectively shifting their role in the supply chain from chip output to process enablement.

  • Capex Optimization: TSMC is turning depreciated assets into high-value infrastructure for its most advanced nodes. This is a classic example of fab lifecycle extension through strategic repurposing.

  • Vertical Integration: By internalizing pellicle production, TSMC reduces reliance on external suppliers like Mitsui or ASML’s partners, tightening control over yield-critical EUV processes.

  • Mike, this feels like a lithography-side analog to chiplet disaggregation—where legacy assets are retooled to support modular, high-performance architectures. Want to riff on how this might affect ArFi’s role in mid-node scaling or the competitive dynamics with Samsung’s pellicle sourcing?
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext