EVG’s new LITHOSCALE® XT 5X higher heterogeneous integration throughput.
EV Group Highlights Hybrid Bonding, Lithography, and Support for U.S. Semiconductor Onshoring at SEMICON West 2025
Shannon Davis
1 week ago
EV Group (EVG), a provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced that it is highlighting the latest developments in hybrid bonding, maskless lithography, metrology and nanometer-precision layer transfer technology at SEMICON West, the premier microelectronics exhibition in North America, to be held next week on October 7-9 in Phoenix, Ariz.
EVG also announces that it is celebrating the 30th anniversary of its fully owned North America subsidiary, based in Arizona, a milestone that coincides with SEMI’s inaugural SEMICON West show in Phoenix. At the event, EVG will highlight its efforts to support onshoring and local innovation in Arizona and throughout North America.
Enabling Semiconductor Scaling with Hybrid Bonding Solutions
At SEMICON West, EV Group will provide technology and market updates on its industry-leading suite of wafer-to-wafer and die-to-wafer hybrid bonding solutions, including the new EVG®40 D2W—the first dedicated metrology system that enables 100 percent die overlay measurement at high throughput. Designed for chiplet integration, high-bandwidth memory (HBM) stacks, and other advanced 3D packaging applications, the EVG40 D2W helps improve process control and yield in high-volume manufacturing (HVM). Executives will be available to discuss the new system, as well as other industry developments in chiplet integration and hybrid bonding.
Meeting Lithography Needs for Heterogeneous Integration
EVG’s new LITHOSCALE® XT brings true high-throughput, high-resolution digital lithography to heterogeneous integration. This next-generation maskless exposure system achieves up to 5X higher throughput than previous solutions, with stitch-free full-wafer patterning and real-time die-shift compensation. LITHOSCALE XT is optimized for AI/HPC interposers, panel-level packaging, and advanced sensor production, as well as die traceability for security and automotive applications. At SEMICON West, executives will be available to discuss LITHOSCALE XT and how digital lithography enables advances in AI, high-performance computing (HPC), and advanced packaging.
Celebrating 30+ Years in Arizona Region
With more than 30 years of operations in the greater Phoenix region, EVG plays a vital role in supporting the growth of U.S. semiconductor manufacturing and advanced packaging. EVG is well positioned to serve regional customers across semiconductors, optics, MEMS, and sensors—supporting key markets like AI and cloud computing, telecom, automotive, and healthcare.
“For three decades, EVG North America has played a key role in supporting our customers as we’ve advanced the semiconductor industry roadmap with our fusion and hybrid bonding, lithography, and metrology process solutions,” stated Hermann Waltl, executive sales and customer support director as well as member of the executive board at EVG. “With the rapid growth of semiconductor manufacturing and packaging in Arizona and across the U.S., our local team continues to provide the process expertise and close collaboration that EVG is known for worldwide. It is exciting to be back at SEMICON West—now in Phoenix—to showcase how we are enabling the next wave of semiconductor scaling and integration.”
See EVG at SEMICON West 2025
SEMICON West attendees interested in learning more about EVG and its suite of wafer bonding, lithography and metrology solutions supporting AI, telecom, automotive, health care and other industries, are invited to visit EVG at Booth #5751 in Hall 1 (Lower Level) on October 7-9 at the Phoenix Convention Center in Phoenix, Ariz.
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