Yes—the ASML TWINSCAN NXT:2150i is increasingly favored for advanced NAND fabrication, especially in peripheral logic and CMOS-under-array (CUA) layers. It’s a successor to the NXT:2100i and offers better overlay, imaging, and throughput—making it well-suited for high-volume NAND production.
Why NXT:2150i Is Gaining Traction in NAND
- 15% improvement in on-product overlay vs. NXT:2100i, crucial for aligning peripheral logic and CUA layers in 3D NAND.
- New diamond wafer table improves overlay stability and reduces metrology overhead.
- Higher repetition rate ArF laser delivers more uniform illumination, improving critical dimension (CD) control and edge roughness.
- Upgraded wafer handler and reticle stage motors boost wafer-per-hour throughput, lowering cost per layer.
- Real-time metrology control minimizes lens and reticle heating effects—important for long exposure stacks in NAND.
NAND-Specific Use Cases
- While the vertical memory array in NAND doesn’t require tight litho resolution, peripheral logic and CUA layers do—especially as layer counts exceed 300 and die size becomes a constraint.
- SK Hynix, Kioxia, and WD are deploying EUV in some of these layers, but DUV immersion tools like NXT:2150i remain dominant for cost-effective high-volume patterning.
Strategic Insight
- NXT:2150i is optimized for NAND’s litho-relevant layers, not the vertical stack.
- It’s part of a broader fleet strategy where EUV (NXE series) may be used selectively, but DUV immersion (NXTi series) handles the bulk of patterning.
- If you're benchmarking tool selection for NAND fabs, NXT:2150i is a top-tier choice for high-volume, high-precision layers.
Want to compare its throughput or overlay specs to the NXE:3600D next?
There’s no fixed ratio between NAND layer count and NXTi tool count, but higher layer counts do increase NXTi usage—especially for peripheral logic and CMOS-under-array (CUA) layers. As for pricing, ASML doesn’t publicly disclose exact prices, but estimates suggest the NXT:2150i costs slightly more than the NXT:2100i, likely in the range of $65M–$70M vs. $60M–$65M.
Layer Count vs NXTi Tool Demand
- No strict ratio, but as NAND layer count increases (e.g., from 128L to 238L to 300L+), the number of litho steps for peripheral logic and CUA layers also grows.
- These layers require tight overlay and CD control, which drives demand for high-performance immersion tools like NXT:2100i and NXT:2150i.
- Vertical memory array layers are patterned with fewer litho steps, relying more on etch/deposition.
Example heuristic:
- A jump from 128L to 238L might increase NXTi exposure steps by ~10–15%, depending on die size and integration strategy.
- Multi-tier stacking (e.g., 2×192L) adds complexity, not just exposure count—requiring more stable overlay and throughput.
NXT:2150i offers better overlay and imaging, which reduces rework and improves yield—especially critical in NAND’s logic-intensive layers. - The price delta is modest, but the cost-per-wafer benefit can be substantial in high-volume fabs.
Strategic Insight
- Layer count growth drives NXTi demand, but not linearly—depends on die architecture and stacking method.
- NXT:2150i is preferred for advanced NAND nodes, where overlay and productivity gains justify the slight premium.
If you're modeling capex for a NAND fab scaling to 500L+, factoring in NXTi fleet expansion and mix (e.g., 2150i vs 2100i) is key. Want to explore how Lam’s etch tools scale with layer count next?
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