Here you go, Elroy. More on HBM and the Big Three memory companies. Worth reading.
SK Hynix, Samsung, Micron Compete for HBM4 Market Dominance
- Editor Kim Eun-jin
- 2025.10.08 19:20
SK Hynix, Micron Technology, and Samsung Electronics are engaged in a razor-thin competition to dominate the HBM4 market, which is estimated to be worth $100 billion (141 trillion won).
Following SK Hynix’s completion of next-generation HBM4 development and establishment of mass production systems last month, Samsung Electronics has also begun preparations for HBM4 mass production. Meanwhile, U.S.-based Micron recently announced that it has started shipping samples of its next-generation HBM4 memory, boasting record-breaking performance and efficiency.
Micron CEO Sanjay Mehrotra stated, “The module has achieved bandwidth of over 2.8TB/s and pin speeds exceeding 11Gbps.” These figures significantly surpass the official JEDEC HBM4 specifications of 2TB/s and 8Gbps.
Micron has begun shipping 12-Hi HBM4 samples to support key customer platform ramps, claiming that this product offers industry-leading performance and best-in-class power efficiency. The company added that its 12-Hi HBM4 product’s key differentiators include Micron’s 1-gamma DRAM and proprietary CMOS-based die and packaging innovations.
Regarding HBM4E, which extends the base design through customized options for the logic die, Micron announced that it will offer not only standard products but also customized options for the base logic die.
CEO Sanjay Mehrotra said, “Customization requires close collaboration with customers, and we expect HBM4E with customized base logic die to provide higher gross margins than standard HBM4E.” He added, “This technology, developed in collaboration with TSMC, allows key customers like NVIDIA and AMD to custom-design accelerators with memory stacks optimized for low latency and better packet routing.”
Micron plans to capture a significantly higher market share in the $100 billion HBM market this year compared to the previous year, and expects revenues from the high bandwidth memory sector to exceed $8 billion this year.
SK Hynix, the leader in the HBM sector, announced that it had shipped 12-Hi HBM4 samples to major customers including NVIDIA in March, ahead of Micron and Samsung, and began preparations for mass production in September.
The 12-Hi HBM4 product sampled by SK Hynix utilizes TSMC’s 12nm process for the logic die, which acts as the brain, and is reported to have a data processing speed of over 2TB (terabytes) per second. However, it has not yet been confirmed whether this product surpasses Micron’s 12-Hi HBM4 product, which boasts bandwidth of over 2.8TB/s.
SK Hynix also plans to provide “custom HBM4E” products for its HBM4E line, reflecting the requirements of customers such as NVIDIA, Broadcom, and AMD.
Samsung Electronics is also reported to have shipped HBM4 samples to customers including NVIDIA in September, with improved operating speeds of 11Gbps per second, matching Micron’s specifications. Samsung is also preparing for mass production of HBM4, aiming to start within this year.
?? : Businesskorea(https://www.businesskorea.co.kr)
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