Secrecy beyond Laser includes HMI eP6 & eScan 2200.
Both will goose Laser demand.
As will all the strides in the Village.
:-)
ASML
Village.
ASML has not publicly updated details on the HMI eP6 or eScan 2200 because both tools are still in internal development or early customer evaluation, and ASML typically withholds specifics until commercial deployment is imminent. This secrecy is common for inspection tools tied to next-gen EUV and high-NA nodes.
HMI eP6: Why the Silence?
- Initial Mentions: The eP6 was briefly referenced in ASML’s internal roadmap slides and industry presentations in early 2024, likely as a successor to the eP5 series.
- No Public Launch: Since then, there’s been no formal announcement, spec sheet, or customer deployment confirmation. This suggests the tool is still in R&D or limited pilot use.
- Possible Reasons:
- Yield sensitivity: eP6 may be tied to high-NA EUV yield tuning, which is still under wraps at Intel and Samsung.
- Tool overlap: ASML may be refining whether eP6 complements or replaces certain eScan variants.
- Market timing: ASML often delays public disclosure until tools are validated by lead customers.
HMI eScan 2200: Status and Speculation
- Mentioned in forums and slides: The eScan 2200 was referenced in 2024 as a next-gen e-beam inspection tool for EUV and high-NA layers.
- No official listing: ASML’s website and product catalog still omit the eScan 2200, suggesting it’s not yet commercially released.
- Industry chatter: Some sources suggest it’s undergoing evaluation at EUV fabs, possibly at Intel’s D1 or Samsung’s Giheung site.
- Technical leap: The 2200 is expected to offer higher throughput and finer resolution for buried defect inspection—critical for 2nm and 3D DRAM.
Strategic Implication
ASML’s silence likely reflects:
- Customer confidentiality: Intel, Samsung, and TSMC are extremely protective of inspection strategies tied to high-NA EUV.
- Tool maturity: These systems may still be in calibration or yield tuning phases.
- Market positioning: ASML may be waiting to align eP6 and eScan 2200 launches with broader high-NA EUV adoption.
If you’d like, I can track e-beam inspection trends or map how these tools affect ATP vendor alignment and Zeiss mirror throughput. |
