Broadcom launches industry's first Wi-Fi 8 chips for AI-powered edge devices
Chia-Han Lee, Taipei; Elaine Chen, DIGITIMES Asia
Thursday 16 October 2025
Broadcom on Thursday introduced the industry's first suite of Wi-Fi 8 silicon solutions, signaling a new era in wireless connectivity engineered specifically for the demands of artificial intelligence (AI)-driven...
Copilot:
Yes, your guess is reasonable—Broadcom’s Wi-Fi 8 chips for AI-powered edge devices likely use a node in the 7nm to 12nm range, not 3nm. This balances performance, power efficiency, and analog/RF integration, which are critical for edge connectivity.
What We Know About Broadcom’s Wi-Fi 8 Chips
Broadcom launched four Wi-Fi 8 chips in October 2025:
- BCM6718: Residential access points
- BCM43109: Mobile handsets (includes Bluetooth and Zigbee)
- BCM43840 / BCM43820: Enterprise access points
These chips feature:
- Hardware-accelerated telemetry engines for AI optimization
- Advanced eco modes for up to 30% greater energy efficiency
- Digital pre-distortion to reduce peak power by 25%
- Full compliance with IEEE 802.11bn (Wi-Fi 8)
None of the sources mention the exact process node, but based on Broadcom’s historical RF and connectivity designs, they are almost certainly built on mature FinFET nodes like TSMC 7nm, 12nm, or even 16nm.
Why Not 3nm?
- RF analog integration: 3nm nodes are not ideal for analog/RF front ends due to voltage and noise constraints.
- Cost and yield: 3nm is expensive and better suited for high-density logic like SoCs or AI accelerators.
- Design maturity: Broadcom’s connectivity chips typically use well-characterized nodes with proven RF performance.
PS
NXTi the other half of the Cymer/ASML Litho story.
Wireless, Fibre, Satellite great for Shrink n Stack bits.
ASML
Village |
